Surface Mount Force Sensing Module Eliminating Flexible Circuit Boards
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Solution Overview
Problem
Traditional force sensing modules require flexible circuit boards for electrical connections, which occupy more space and are prone to damage from external impacts, necessitating a compact and robust solution for mobile devices.
Innovation Solution
A surface mount force sensing module design featuring piezo materials with top and bottom substrates, conductive pads, and side wall metals, utilizing a gap maintained by a ring spacer to ensure open-circuit operation at zero force, allowing for minimal footprint and robust connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible circuit board is used for electrical connection, then electrical connectivity is achieved, but the module occupies more space and becomes prone to damage from external impacts
Solution Approach 1:
The patent extracts and eliminates the flexible circuit board from the force sensing module, replacing it with direct electrical connection structures (conductive pads and contact structures) that are integrated into the substrate. This removal of the flexible circuit board directly reduces space occupancy while eliminating the vulnerability to external impact damage, as the rigid integrated structure has no flexible components that can be severed.
2Device complexity
If a flexible circuit board is used for electrical connection, then electrical connectivity is achieved, but the connection structure becomes more complex
Solution Approach 1:
The patent merges the electrical connection function directly into the substrate structure by integrating conductive pads and contact structures with the force sensing element. This consolidation eliminates the need for separate flexible circuit boards and external connectors, simplifying the overall connection structure while enhancing robustness through the integrated rigid design that cannot be easily severed or damaged.
3Area of stationary object
If piezo materials with substrates and conductive pads are used, then a compact structure is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary action by pre-configuring the piezo materials, conductive pads, and contact structures in precise predetermined positions during the substrate fabrication process. The piezo materials are positioned between the top and bottom substrates with pre-established conductive paths, and the contact structures are pre-aligned to ensure proper electrical connection. This preliminary positioning during manufacturing ensures that the compact integrated structure achieves the required precision without requiring additional alignment steps during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, robust force sensing module with reduced space occupancy and enhanced durability by eliminating the need for flexible circuit boards, enabling efficient force detection in mobile devices.
Implementation Method 1
A top piezo material 221 is configured on a bottom surface of the top inner electrode 231. A bottom piezo material 222 is configured on a top surface of the bottom inner electrode 232.
Data Source
AI summary
A surface mount force sensing module is disclosed. A first embodiment shows that the surface mount force sensing module has a bottom electrode designed to be mounted on a circuit board. A second, third, and fourth embodiments show that the sensing module has a pair of bottom electrodes amenable for mounting onto a circuit board.