Surface Mount Interconnect Structure for Thermal and Mechanical Decoupling
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Solution Overview
Problem
Existing surface mount technologies face challenges in optimizing the mechanical reliability of interconnects due to the trade-off between electrical, thermal, and mechanical design requirements, which hampers individual optimization of these functions.
Innovation Solution
A method of forming a device with a surface mount component attached to a substrate using discrete mechanical coupling parts and a bonding layer, where the mechanical coupling parts are formed through 3D printing or machining, allowing for separate optimization of thermal, electrical, and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive materials are used for mechanical connection, then mechanical compliance is improved, but thermal conductivity deteriorates
Solution Approach 1:
The interconnect structure is segmented into distinct functional zones: a mechanical coupling part made of compliant material for mechanical connection, and a thermal/electrical bonding layer for heat and electricity transfer. This segmentation allows each part to be optimized for its specific function without compromise.
Solution Approach 2:
A bonding layer acts as an intermediary between the mechanical coupling part and the surface mount component, separating the mechanical function from the thermal and electrical functions. This intermediary layer enables independent optimization of each function.
2Temperature
If solder materials are used for mechanical connection, then thermal conductivity is improved, but fatigue resistance deteriorates
Solution Approach 1:
The interconnect is divided into a mechanical coupling part that absorbs thermal expansion stresses through compliance, and a separate bonding layer that provides thermal conduction pathways. This segmentation protects the brittle solder from fatigue while maintaining thermal performance.
Solution Approach 2:
The compliant mechanical coupling part serves as a cushioning element that absorbs and accommodates thermal expansion mismatches before they can cause fatigue damage to the solder joints, thereby protecting the interconnect reliability.
3Ease of manufacture
If a single material is used for interconnect, then manufacturing simplicity is improved, but functional optimization deteriorates
Solution Approach 1:
The interconnect employs composite construction with different materials optimized for specific functions: compliant material for mechanical coupling, conductive adhesive or solder for thermal and electrical bonding. This composite approach enables simultaneous optimization of mechanical, thermal, and electrical properties.
Solution Approach 2:
Different regions of the interconnect have different material properties tailored to local requirements: the mechanical coupling part has high compliance for stress absorption, while the bonding layer has high thermal and electrical conductivity for efficient energy transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the optimization of thermal, electrical, and mechanical properties individually, eliminating the need for trade-offs and improving the mechanical lifetime and reliability of the interconnects.
Implementation Method 1
the bonding layer may specifically be designed for its thermal characteristics
Implementation Method 2
The bonding layer may be designed to provide both electrical and thermal interconnection
Data Source
Figure 1~4(c)
Figure 5(a)~6
Figure 7(a)~7(d)
AI summary
A device comprises a surface mount component on a substrate, in which the surface mount component is attached by a set of discrete mechanical coupling parts and by a bonding layer. This enables the mechanical coupling properties and the electrical/thermal properties to be optimized separately.