Surface Mount Light Emitting Module With Integrated Light Guide
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Solution Overview
Problem
Conventional circuit board indicators (CBIs) face assembly and reliability issues, particularly with through-hole LEDs that do not survive surface mount reflow processing due to high temperatures, necessitating a more reliable and easier-to-assemble light emitting module.
Innovation Solution
A light emitting module comprising a housing with integrated light guide elements and light emitting elements, where the light emitting elements are coupled to the housing via a coupling portion, allowing for surface mounting on a circuit board without the need for insertion holes, enhancing assembly convenience and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-hole LEDs are used in conventional circuit board indicators, then the LEDs can be mounted on circuit boards, but they do not survive surface mount reflow processing with high temperature
Solution Approach 1:
The patent changes the mounting parameters from through-hole insertion to surface mount configuration. The LED package is redesigned with a flat bottom surface that sits directly on the circuit board surface, and electrical connections are established through solder pads on the board surface rather than through-holes. This parameter change allows the assembly to withstand reflow processing temperatures while simplifying the manufacturing process.
Solution Approach 2:
The patent segments the LED package into distinct functional components: a light-emitting chip mounted on a substrate, with separate electrical connection terminals arranged on the bottom surface. This segmentation allows each component to be optimized independently - the chip for light emission, the substrate for mechanical support and heat dissipation, and the terminals for electrical connection - resulting in a package that can survive reflow processing.
2Ease of operation
If through-hole LEDs are used, then electrical connection can be established, but insertion holes must be formed on circuit boards which increases assembly complexity
Solution Approach 1:
The patent inverts the traditional mounting approach: instead of inserting the LED through holes in the circuit board, the LED package is designed to mount on the surface of the board. The electrical connection terminals are arranged on the bottom surface of the package, allowing soldering to pads on the board surface. This inversion eliminates the need for insertion holes while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable and easy-to-assemble light emitting module that can be securely mounted on a circuit board, ensuring consistent performance and reducing the risk of assembly failures associated with high-temperature processing.
Implementation Method 1
light emitted from the light emitting surface enters the light incident surface of the at least one light guide element and is then emitted from the light emergent surface of the at least one light guide element
Data Source
AI summary
A light-emitting device and a light emitting module are provided. The light emitting module includes a housing, at least one light guide element, and at least one light emitting element. The housing includes at least one passage passing through its a first surface and a second surface, and a coupling portion formed on an inner surface adjacent to the second surface. The light guide element arranged in the at least one passage has a light emergent surface exposed at one end of the at least one passage and a light incident surface exposed at the other end of the at least one passage. The light emitting element is coupled to the housing by the coupling portion. The light emitting element includes a light emitting surface facing to the light incident surface of the light guide element and a soldering portion exposed from the housing.