Surface-Mountable Pixel Packages for High-Resolution Display Assembly
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Solution Overview
Problem
Current surface-mount technology is limited in its ability to achieve high-resolution displays due to size constraints, making it difficult to efficiently integrate arrays of pixels on a display substrate at a low cost.
Innovation Solution
The method involves creating a surface-mountable pixel engine package with an array of spaced-apart conductive pillars and an insulating mold compound on a substrate, allowing for the transfer printing of pixel engines with connection posts in electrical contact, followed by assembly using surface-mount technology, which enables the integration of high-resolution pixel arrays on a display substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional surface-mount technology is used, then manufacturing cost is reduced and production throughput is increased, but display resolution is limited due to size constraints of packaged electronic devices
Solution Approach 1:
The invention divides the pixel array into modular pixel engine packages that can be independently manufactured and then assembled. Each pixel engine package contains multiple sub-pixels and associated circuitry, allowing parallel fabrication and reducing the minimum feature size constraints of conventional surface-mount technology while maintaining cost-effectiveness through standardized packaging.
Solution Approach 2:
The patent implements a hierarchical packaging structure where pixel engines are integrated into pixel engine packages, which are then assembled into arrays on the display substrate. This nested architecture allows small, high-precision pixel engines to be manufactured separately and then combined into larger display structures, overcoming the size limitations of direct surface-mounting while preserving manufacturing efficiency.
2Manufacturing precision
If inorganic light-emitting diodes are assembled on a display substrate to achieve high resolution, then display resolution is improved, but manufacturing complexity increases
Solution Approach 1:
The invention performs preliminary assembly and testing of pixel engines into complete pixel engine packages before final integration onto the display substrate. This includes pre-attaching inorganic LEDs, forming electrical connections, and conducting functional tests on individual packages, thereby simplifying the final assembly process and reducing overall manufacturing complexity while achieving high-resolution displays.
Data Source
AI summary
A method of making a surface-mountable pixel engine package comprises providing an array of spaced-apart conductive pillars and an insulating mold compound laterally disposed between the conductive pillars on a substrate together defining a planarized surface. Pixel engines comprising connection posts are printed to the conductive pillars so that each of the connection posts is in electrical contact with one of the conductive pillars. The pixel engines are tested to determine known-good pixel engines. An optically clear mold compound is provided over the planarized surface and tested pixel engines. Optically clear mold compound is adhered to a tape and the substrate is removed. The optically clear mold compound, the insulating mold compound, the conductive pillars, the optically clear mold compound, and the tested pixel engines are singulated to provide pixel packages that comprise the pixel engines and the known-good pixel engines are transferred to a reel or tray.