Surface-Mount Power Package With Redundant Gate and Sense Links
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Solution Overview
Problem
Molded power semiconductor packages in mission-critical applications lack redundancy in internal connections for sense and control functions, leading to potential device failure if a single connection fails.
Innovation Solution
The design incorporates redundant electrical connections for sense and gate functions within the package, ensuring continued operation even if a primary connection fails. These redundant connections are encased in a mold compound for protection and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single internal connection is used for sense or gate functions, then the device structure is simple and manufacturing is easier, but the reliability decreases because failure of the single connection leads to overall device failure
Solution Approach 1:
The patent applies preliminary action by pre-configuring redundant electrical connections within the package during manufacturing. The redundant gate connection and redundant sense connection are established beforehand, so that if the primary connection fails during operation, the redundant connection is already in place to immediately take over and maintain device functionality.
Solution Approach 2:
The patent implements beforehand cushioning by incorporating backup electrical pathways that protect against connection failures. The redundant connections act as a cushion or safety net, ensuring that if the primary sense or gate connection fails, the device continues to operate through the redundant pathway, preventing catastrophic failure.
2Reliability
If redundant electrical connections are added for sense and gate functions, then the reliability improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the primary and redundant electrical connections into a unified package structure. Both the primary sense/gate connections and the redundant connections are integrated within the same package, sharing common elements such as the substrate, mold compound, and terminal structures. This merging approach allows redundant functionality to be achieved without proportionally increasing manufacturing complexity.
Solution Approach 2:
The package structure is designed with universal elements that serve multiple functions. For example, the substrate and mold compound accommodate both primary and redundant connections, and the terminal structures can handle both primary and backup pathways. This multi-functionality reduces the need for separate dedicated structures for each connection type.
Data Source
AI summary
A molded surface mount package includes: a power semiconductor die attached to a metallic pad with a first side facing the pad and a second (opposite) side facing away from the pad, the metallic pad forming a first power terminal exposed at a surface mounting side of the package; a second power terminal, a first sense terminal, and a gate terminal each exposed at the surface mounting side and spaced apart from the first power terminal; a first electrical connection between the second power terminal and a first power pad at the second side of the die; a second electrical connection between the gate terminal and a gate pad at the second side of the die; a third electrical connection between the first sense terminal and a first sense pad at the second side of the die; and a first redundant electrical connection for the second or third electrical connection.