Surface-Mount Piezoelectric Shear Sensor Without Wire Bonding

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Solution Overview

Problem

Existing piezoelectric shear sensors require two precision bonding operations and a secondary wire bonding step, making them difficult to manufacture, costly, and potentially less reliable.

Innovation Solution

A surface mountable piezoelectric sensor design featuring oppositely polarized, parallel piezoelectric members separated by an isolator, with a series circuit connection and a proof mass, eliminating the need for secondary conductive epoxy and wire bonding operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If two precision bonding operations and wire bonding are used to connect piezoelectric members to the printed circuit board, then electrical connections are achieved, but manufacturing complexity and cost increase while reliability decreases

Engineering Contradiction:

Improvesensor reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple bonding operations into a single surface mount operation. The piezoelectric members are designed with integrated mounting features that allow direct surface mounting to the printed circuit board, eliminating the need for separate conductive epoxy bonding and wire bonding operations. This merging of operations reduces manufacturing complexity and potential failure points.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces complex mechanical bonding operations (conductive epoxy bonding and wire bonding) with a standardized surface mount technology process. The piezoelectric members are designed with electrical contacts that directly interface with surface mount pads on the PCB, substituting multi-step mechanical bonding with a single automated surface mount operation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If multiple bonding operations are required for assembling the piezoelectric sensor, then electrical connections are established, but manufacturing time and cost increase

Engineering Contradiction:

Improvesensor manufacturabilityVSAvoidmanufacturing cycle time

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The patent merges multiple discrete bonding operations into a single surface mount assembly step. The piezoelectric members are configured to be mounted directly to the PCB using standard surface mount technology, combining electrical connection and mechanical mounting into one operation performed by automated pick-and-place equipment.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The piezoelectric members are pre-configured with integrated electrical contacts and mounting features during manufacturing. This preliminary design allows them to be directly surface mounted to the PCB without requiring subsequent bonding or wire attachment operations, reducing assembly steps and cycle time.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If conductive epoxy and wire bonding are used to connect electrodes, then electrical potential is accessible, but the manufacturing process becomes more costly and less reliable

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces conductive epoxy bonding and wire bonding with direct surface mount electrical contacts. The piezoelectric members are designed with exposed electrical contacts that interface directly with surface mount pads on the PCB, eliminating the need for conductive epoxy and wire bonding operations entirely.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent combines electrical connection and mechanical mounting functions into a single surface mount interface. The piezoelectric members have integrated contacts that simultaneously provide electrical connectivity and structural attachment to the PCB, eliminating separate bonding and wiring steps.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates easier manufacturing, reduces costs, and enhances reliability by enabling automation with surface mount technology, while maintaining sensor functionality.

Implementation Method 1

the voltage output by the piezoceramic material when it is subject to shear stress to determine the acceleration experience by the printed circuit board

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS20260052908A1Surface mountable piezoelectric shear sensor and accelerometer incorporating same

Publication Date: 2026.02.19 MIDÉ TECHNOLOGY CORP

AI summary

A surface mountable piezoelectric sensor includes a pair of oppositely polarized, spaced, parallel piezoelectric members separated by an isolator. A first electrode is associated with the piezoelectric members bridging the isolator resulting in a series circuit when the pair of piezoelectric members are mounted to a printed circuit board. A second electrode is associated with one piezoelectric member and electrically isolated from a third electrode associated with the other piezoelectric member for surface mounting to the printed circuit board.