Surface Plate Cleaning Nozzle Angles Groove Sludge
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Solution Overview
Problem
In the lapping process of semiconductor wafers, accumulated foreign substances and slurry in the grooves of surface plates can hinder slurry supply and discharge, leading to wafer surface deterioration and potential scratching.
Innovation Solution
A surface plate cleaning apparatus with an injection unit featuring multiple nozzles of varying separation distances and angles to effectively inject cleaning solutions onto the surface plates, ensuring thorough removal of sludge from both the surface and grooves, preventing scratches and maintaining wafer flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single-type nozzle is used for cleaning surface plates, then the device structure is simple, but the cleaning effectiveness on grooves and surfaces is insufficient
Solution Approach 1:
The cleaning device segments the nozzle system into multiple types: first injection nozzles for surface cleaning, second injection nozzles for groove cleaning, third injection nozzles for secondary surface cleaning, and fourth injection nozzles for secondary groove cleaning. Each nozzle type is positioned and angled specifically to address different cleaning needs, thereby improving overall cleaning effectiveness while maintaining manageable structural complexity through functional division.
Solution Approach 2:
Different nozzle types are designed with specific local qualities suited to their cleaning targets. The first and third injection nozzles are configured with angles and positions optimized for surface cleaning, while the second and fourth injection nozzles are positioned to target groove areas. This local optimization ensures that each region of the surface plate receives cleaning treatment tailored to its geometric characteristics.
2Manufacturing precision
If multiple cleaning solutions are injected at the same distance and angle, then the injection system is simple, but the cleaning coverage and effectiveness are limited
Solution Approach 1:
The injection system employs asymmetric parameters for different nozzle types. The first injection nozzles are positioned at a first distance with a first injection angle, while the second injection nozzles are positioned at a second distance with a second injection angle, and similarly for the third and fourth nozzles. This asymmetric configuration allows each nozzle type to optimize its cleaning coverage for specific areas, improving overall cleaning effectiveness while the systematic parameter variation keeps the control structure manageable.
3Productivity
If cleaning is not performed periodically, then the operation time is reduced, but sludge accumulates in grooves and hinders slurry flow
Solution Approach 1:
The cleaning apparatus performs preliminary cleaning actions by periodically removing sludge and foreign substances from the surface plates before they can significantly accumulate and interfere with the lapping process. The multiple nozzle system is designed to proactively maintain clean grooves and surfaces, preventing the hindrance of slurry flow before it occurs, thereby ensuring continuous productivity with minimal interruption.
4Reliability
If sludge accumulates in grooves, then the structure remains unchanged, but wafer flatness deteriorates and scratches occur
Solution Approach 1:
The cleaning system specifically targets and extracts sludge and foreign substances from the grooves of the surface plates. The second and fourth injection nozzles are positioned and angled to directly address groove areas, injecting cleaning solutions that remove accumulated sludge. This extraction of harmful substances from critical areas prevents wafer scratches and maintains wafer flatness, thereby improving reliability while eliminating the harmful effect of sludge accumulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves the cleaning efficiency of surface plates, ensuring smooth slurry flow and preventing scratches on wafers by effectively removing sludge from grooves, thereby maintaining the flatness and quality of the wafer surface.
Implementation Method 1
at least one first injection nozzle (312) and at least one second injection nozzle (314) disposed on an upper surface (305a) of the injection head (305)... a first separation distance (d1) from the upper surface (305a) of the injection head (305) to the first injection hole (312a) and a second separation distance (d2) from the upper surface (305a) of the injection head (305) to the second injection hole (314a) are different... a first injection angle (θ1) of the first cleaning solution (50a) and a second injection angle (θ2) of the second cleaning solution (50b) are different
Data Source
AI summary
Disclosed is a surface plate cleaning apparatus which cleans the surfaces of surface plates having grooves. The surface plate cleaning apparatus includes an injection unit including an injection head, and at least one first injection nozzle and at least one second injection nozzle, and a moving unit configured to move the injection unit, the at least one first injection nozzle includes a first injection hole to inject a first cleaning solution, the at least one second injection nozzle includes a second injection hole to inject a second cleaning solution, a first separation distance from the upper surface of the injection head to the first injection hole and a second separation distance from the upper surface of the injection head to the second injection hole are different, and a first injection angle of the first cleaning solution and a second injection angle of the second cleaning solution are different.