Surface Radiator With Liquid Cooling for Stable LED Operation
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Solution Overview
Problem
Existing surface radiators with light-emitting semiconductor components, such as LEDs, face challenges with inadequate heat dissipation and thermal decoupling, leading to reduced service life and performance due to high operating temperatures.
Innovation Solution
A surface radiator design featuring a housing body with integrated cooling channels and a fluid path filled with an electrically insulating liquid coolant that directly contacts the LEDs, allowing for efficient heat dissipation and thermal decoupling by flooding the emission chamber, minimizing heat accumulation, and preventing condensation and harmful substance exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LEDs are operated at nominal power, then lighting performance is improved, but service life is reduced due to high temperatures
Solution Approach 1:
The patent implements preliminary cooling actions by providing cooling channels and heat dissipation structures before the LEDs reach damaging temperatures. The cooling fluid is circulated through channels positioned to remove heat from LED mounting areas, preventing thermal accumulation that would otherwise reduce service life during nominal power operation.
Solution Approach 2:
The patent introduces a cooling fluid as an intermediary substance that mediates heat transfer between the LEDs and the external environment. The fluid circulates through cooling channels, absorbing heat from the LEDs and transporting it away, thereby enabling nominal power operation without excessive temperature rise that would harm service life.
2Illumination intensity
If the number of LEDs is increased to attain desired light quantity, then lighting performance is improved, but heat dissipation becomes insufficient
Solution Approach 1:
The patent segments the heat dissipation function by providing multiple cooling channels distributed across the housing body. Each cooling channel serves a specific region, allowing heat from multiple LEDs to be dissipated simultaneously and efficiently. This segmented approach enables handling of increased heat loads from higher LED counts.
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional cooling by incorporating cooling channels that extend through the housing body volume. This volumetric cooling approach provides additional heat dissipation capacity proportional to the number of LEDs, enabling scaling of light quantity without proportional heat accumulation problems.
3Ease of manufacture
If printed circuit board is used for mounting LEDs, then ease of manufacture is improved, but heat dissipation is insufficient
Solution Approach 1:
The patent merges the electrical mounting function (printed circuit board) with the thermal management function (cooling channels) by integrating both into a single housing structure. The housing body simultaneously provides mechanical support for the printed circuit board and contains cooling channels that directly cool the LED mounting areas, combining manufacturing simplicity with effective heat dissipation.
Solution Approach 2:
The patent employs hydraulic cooling by circulating a cooling fluid through channels formed in the housing body. This fluid-based cooling system replaces or supplements conventional air cooling or thermal paste approaches, providing superior heat dissipation capacity while maintaining ease of manufacture through integrated channel formation in the housing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation and thermal decoupling, maintaining LED temperature stability, increasing total light performance, and protecting LEDs from harmful substances, while avoiding near-field reflection and extending the service life of the LEDs.
Implementation Method 1
A surface radiator design featuring a housing body with integrated cooling channels and a fluid path filled with an electrically insulating liquid coolant that directly contacts the LEDs, allowing for efficient heat dissipation
Implementation Method 2
allowing for efficient heat dissipation and thermal decoupling by flooding the emission chamber, minimizing heat accumulation
Data Source
AI summary
A surface radiator includes a light-emitting semiconductor component and a housing body. The housing body has a cooling channel forming part of a fluid path from an inlet opening to a return opening. A transparent emission window overlies the light-emitting semiconductor component. The housing body provides an attachment surface spaced apart from the emission window for the light-emitting semiconductor component. The arrangement of the emission window on the housing body is formed in a fluid-tight manner. The housing body, the semiconductor component and the emission window delimit an emission chamber. The fluid path is defined by a first cooling channel, which extends from the inlet opening through the housing body to an orifice opening, the emission chamber, and a second cooling channel, which extends from the discharge opening through the housing body to the return opening. The coolant is an electrically insulating liquid, which is transparent for the incident radiation.