Surface-Reinforced Packaging Layer for Debris-Resistant Reliability

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Solution Overview

Problem

Existing LED packaging materials face reliability issues due to excessive internal stress causing lead breakage or debris penetration, with anti-adhesive coatings increasing process complexity and becoming less effective as package sizes shrink.

Innovation Solution

A packaging device with a reinforcement layer formed on the upper surface of the packaging layer, where the packaging and reinforcement layers share elements but have different elemental contents, achieved through a surface treatment process like ultraviolet ozone treatment, enhancing hardness and reducing debris penetration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the hardness of the packaging material is increased to prevent debris penetration, then debris resistance is improved, but internal stress increases causing lead breakage or packaging material cracking

Engineering Contradiction:

Improvedebris penetrationVSAvoidlead breakage or packaging material cracking

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent applies local quality by creating a reinforcement layer with different elemental composition specifically on the upper surface of the packaging layer. This localized modification increases surface hardness where debris penetration is a concern, while the bulk packaging material maintains its original properties to avoid excessive internal stress and reliability issues.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by combining the packaging layer with a reinforcement layer having different elemental contents. The composite structure integrates the protective benefits of higher surface hardness with the stress-relief properties of the underlying packaging material, resolving the contradiction between debris resistance and reliability.

Inventive Principle:

Principle #40Composite materials

2Reliability

If the hardness of the packaging material is decreased to reduce internal stress, then reliability is improved, but debris penetration increases

Engineering Contradiction:

Improveinternal stress reductionVSAvoiddebris penetration

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The reinforcement layer applies local quality by concentrating the hardness enhancement only on the upper surface where debris contact occurs. The lower packaging layer maintains lower hardness to reduce internal stress, achieving both reliability improvement and debris protection simultaneously.

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If anti-adhesive agents are coated on the packaging material to reduce debris adhesion, then debris penetration is reduced, but process complexity increases and solvent handling issues arise

Engineering Contradiction:

Improvedebris adhesionVSAvoidprocess complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent replaces the chemical approach of coating anti-adhesive agents with a physical/structural approach of creating a reinforcement layer through surface treatment. This substitution eliminates solvent handling issues and process complexity while achieving the same goal of reducing debris adhesion and penetration.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Volume of moving object

If package sizes are reduced to meet market demands, then product miniaturization is achieved, but the number of cuttings increases leading to more debris generation

Engineering Contradiction:

Improvepackage sizeVSAvoiddebris generation

Core Design Contradiction:

Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by modifying the elemental composition and physical properties of the packaging layer surface through the reinforcement layer. This parameter modification increases surface hardness and debris resistance, compensating for the increased debris generation that results from smaller package sizes requiring more cuttings.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reinforcement layer provides appropriate surface hardness to prevent debris penetration and overcome reliability issues, improving manufacturing yield and reliability while simplifying the process and reducing costs.

Implementation Method 1

A reinforcement layer is formed on an upper surface of the packaging layer. The packaging layer and the reinforcement layer have the same elements, but elemental contents in the packaging layer and the reinforcement layer are different.

Methodology Applied

Scientific EffectSurface treatment process:

Implementation Method 2

The packaging layer and the reinforcement layer have the same elements, but elemental contents in the packaging layer and the reinforcement layer are different

Methodology Applied

Scientific EffectElemental composition gradient:

Data Source

PatentUS20250385150A1Packaging device

Publication Date: 2025.12.18 LITE ON OPTO TECH (CHANGZHOU) CO LTD

AI summary

A packaging device is provided. The packaging device includes a chip and a packaging layer. The chip is encapsulated by the packaging layer. A surface reinforcement layer is formed on an upper surface of the packaging layer. The packaging layer and the surface reinforcement layer have the same elements, but elemental contents in the packaging layer and the surface reinforcement layer are different.