Surface Temperature Estimation Using Segmented Thermal Models
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Solution Overview
Problem
Portable electronic devices face challenges in accurately estimating surface temperature due to shape constraints, which hinder effective cooling, leading to insufficient heat dissipation and potential overheating, especially when multiple heat sources are involved, as traditional methods struggle with rapid temperature changes and complex thermal paths.
Innovation Solution
An electronic apparatus with a processor that calculates heat source temperatures using a first heat transfer model not accounting for transient responses to temperature sensors, and then estimates surface temperature using a second heat transfer model that includes parameters for transient responses to the housing surface, allowing for timely and accurate control of heat sources to reduce surface temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple temperature sensors are used to measure temperatures at multiple internal locations, then estimation accuracy of surface temperature is improved, but computational effort increases significantly
Solution Approach 1:
The patent divides the thermal system into distinct segments: heat sources, intermediate temperature sensors, and the housing surface. By segmenting the thermal paths and assigning different modeling approaches to different segments, the system handles multiple heat sources and sensors without requiring a single complex model that would demand excessive computational resources.
Solution Approach 2:
The patent changes the parameters used in different parts of the thermal model. The first heat transfer model uses parameters suitable for heat source to sensor calculation, while the second model uses different parameters optimized for sensor to surface calculation. This parameter differentiation allows accurate surface temperature estimation without requiring a computationally intensive unified model.
2Measurement precision
If transient response parameters are included in the heat transfer model, then accuracy for rapid temperature changes is improved, but computational effort increases
Solution Approach 1:
The patent applies local quality by using different model complexities in different parts of the thermal system. The first heat transfer model (heat source to sensor) uses a simpler approach without transient response parameters, while the second model (sensor to surface) incorporates transient response parameters. This localized application of model complexity optimizes accuracy where needed while minimizing overall computational burden.
3Speed
If heat transfer paths are made shorter to reduce thermal delay, then response time is improved, but device design flexibility is reduced
Solution Approach 1:
The patent introduces an intermediary computational approach that bridges the gap between physical distance and thermal response. By using a two-stage heat transfer model with intermediate temperature sensors as mediators, the system can accurately estimate surface temperature even when direct heat transfer paths are long or complex, without requiring physical redesign to shorten thermal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables timely and accurate estimation of surface temperature, reducing computational effort and improving the accuracy of heat source control, thereby enhancing cooling efficiency and preventing overheating in portable devices.
Implementation Method 1
calculating heat source temperatures of a plurality of heat sources disposed on the substrate from temperatures measured by the temperature sensors by using a first heat transfer model not including a first parameter representing a transient response of heat transfer from the heat sources to the temperature sensors; and calculating a surface temperature of the surface of the housing from the heat source temperatures by using a second heat transfer model including the first parameter and a second parameter representing a transient response of heat transfer from the heat sources to the surface
Data Source
AI summary
An electronic apparatus includes a housing; a substrate disposed on the inner side of the housing; a plurality of temperature sensors disposed on the substrate; and a processor. The processor performs a procedure including calculating heat source temperatures of a plurality of heat sources disposed on the substrate from temperatures measured by the temperature sensors by using a first heat transfer model not including a first parameter representing a transient response of heat transfer from the heat sources to the temperature sensors; and calculating a surface temperature of a surface of the housing from the heat source temperatures by using a second heat transfer model including the first parameter and a second parameter representing a transient response of heat transfer from the heat sources to the surface.