Module-Specific Thermal Control Using Surface Temperature Prediction
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Solution Overview
Problem
Electronic devices enter a heating control mode unnecessarily due to variations in internal and surface temperatures, leading to inefficient operation of modules that do not require such control.
Innovation Solution
A method for predicting surface temperatures using internal temperature data and a surface temperature prediction model to identify heat sources and generate a heat map, allowing selective activation of heating control only for modules exceeding a specified entry temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic device enters heating control mode based on internal temperature, then overheating is prevented, but modules that do not require control are unnecessarily restricted
Solution Approach 1:
The patent divides the electronic device into multiple temperature zones by placing temperature sensors at different locations (first temperature sensor near first module, second temperature sensor near second module). This segmentation allows independent temperature monitoring and control for each module, enabling selective heating control rather than global control, thus preventing unnecessary restrictions on modules that do not require control.
Solution Approach 2:
The patent implements local temperature control by associating specific temperature thresholds with specific modules. Each module has its own temperature monitoring and control parameters, allowing the system to apply heating control only to the specific module that exceeds its threshold while maintaining normal operation of other modules. This local quality approach resolves the contradiction between reliable overheating prevention and maintaining overall system productivity.
2Reliability
If collective heating control is applied to the entire device, then safety is ensured, but performance is reduced for modules operating within safe temperature ranges
Solution Approach 1:
The patent segments the heating control system into module-specific control units, each with its own temperature sensor and control logic. This allows the system to maintain high reliability through comprehensive temperature monitoring while avoiding unnecessary power reduction in modules that are operating within safe temperature ranges, thus resolving the contradiction between device safety and module performance.
Solution Approach 2:
The patent applies partial heating control by activating control measures only for the specific module that exceeds its temperature threshold, rather than applying control to the entire device. This partial action maintains device safety for the affected module while preserving full performance for modules operating within safe ranges, effectively resolving the contradiction between safety and performance.
3Temperature
If heating control mode is activated based on internal temperature, then heat generation is reduced, but unnecessary activation occurs when surface temperature is acceptable
Solution Approach 1:
The patent segments the temperature monitoring system into multiple independent sensor units positioned at different locations within the device. Each sensor monitors the temperature of nearby modules independently, allowing the system to accurately determine which specific module requires control. This segmentation eliminates false activation of heating control mode by ensuring that control is triggered only when the actual heat-generating module exceeds its threshold, not when other cooler modules are involved.
Solution Approach 2:
The patent implements local temperature threshold association, where each module has its own temperature threshold and control parameters. This local quality approach ensures that heating control activation is accurately tied to the actual thermal conditions of the specific module, preventing unnecessary activation when surface temperature or other non-heat-generating areas are warm. The control activation accuracy is thus improved by matching control actions to the actual local thermal requirements.
Data Source
AI summary
An electronic device, including: at least one sensor; a communication circuit; a memory; and at least one processor operationally connected with the at least one sensor, the communication circuit, and the memory, wherein the at least one processor is configured to: identify an internal temperature of the electronic device using the at least sensor; provide, to an external device, internal temperature data associated with the internal temperature of the electronic device; receive a surface temperature prediction model for predicting a surface temperature of the electronic device from the external device; predict the surface temperature of the electronic device based on the surface temperature prediction model and information associated with a module location, the information being stored in the memory; and select at least one heat source to enter heating control from among a plurality of modules of the electronic device based on the predicted surface temperature.


