Portable Device Thermal Control Using Surface Temperature Limits

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Solution Overview

Problem

Conventional dynamic thermal management in handheld devices relies on PCB temperature, which does not accurately reflect surface temperature, leading to premature throttling and performance issues.

Innovation Solution

A method and circuit for calculating a dynamic junction temperature limit based on both surface and junction temperatures, using a buffer and calculating circuit to adjust thermal parameters and determine appropriate power budgets for the portable device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If PCB temperature is used for thermal management, then thermal throttling can be implemented, but the throttling occurs prematurely before surface temperature reaches upper limit

Engineering Contradiction:
Improvethermal management accuracyVSAvoiddevice performance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces the conventional PCB temperature sensing approach with an optical measurement system. A camera captures thermal images of the device surface, and image processing algorithms extract actual surface temperature data. This optical substitution eliminates the distance-related measurement error between PCB and surface, enabling accurate real-time surface temperature monitoring without premature throttling.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a temperature calibration curve as an intermediary between the optical temperature measurement and the thermal management decision-making system. The calibration curve, established through controlled heating experiments, maps the relationship between surface temperature and internal component temperature. This intermediary enables accurate inference of internal temperatures from surface measurements, resolving the contradiction between surface temperature monitoring and internal thermal management.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If conservative thermal throttling is applied, then surface temperature safety is ensured, but device performance is unnecessarily reduced

Engineering Contradiction:
Improvesurface temperature controlVSAvoidprocessor performance
Core Design Contradiction:
ReliabilityVSPower

Solution Approach 1:

The patent implements a closed-loop feedback system that continuously monitors actual surface temperature via optical measurement, compares it with the upper temperature limit, and dynamically adjusts the thermal throttling strategy. Instead of conservative pre-throttling, the system maintains full performance until surface temperature actually approaches the limit, then applies targeted throttling only when necessary. This feedback mechanism eliminates unnecessary performance reduction while ensuring temperature safety.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent transitions from static thermal management thresholds to dynamic, real-time temperature-based control. The thermal management parameters (such as power limits and throttling levels) are continuously adjusted based on the measured surface temperature and the calibrated relationship with internal component temperatures. This dynamic approach allows the system to maintain optimal performance across varying thermal conditions while preventing unsafe temperature excursions.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS11762439B2Method and apparatus of dynamic thermal management based on surface temperatures of portable device
Publication Date: 2023.09.19 MEDIATEK INC
  • US11762439B2 patent drawing
  • US11762439B2 patent drawing
  • US11762439B2 patent drawing

AI summary

The present invention provides a method of dynamic thermal management applied to a portable device, wherein the method includes the steps of: obtaining a surface temperature of the portable device; obtaining a junction temperature of a chip of the portable device; and calculating an upper limit of the junction temperature according to the junction temperature and the surface temperature.