Surface-Treated Copper Foil for High-Frequency PCBs
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Solution Overview
Problem
Conventional surface treatment methods for copper foils enhance adhesive strength but compromise high-frequency signal transmission, as excessive treatment leads to increased interference with high-frequency characteristics.
Innovation Solution
A surface-treated copper foil with a surface-treated layer containing copper particles of 10 nm to 100 nm diameter and a 10-point average roughness of 0.2 μm to 0.5 μm, combined with an oxidation preventing layer containing nickel and phosphorus, is developed, achieving excellent adhesive strength with resin substrates while maintaining low transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If current flow is amplified and deposition amount of granular copper is increased during surface treatment to increase 10-point average roughness, then adhesive strength with resin is improved, but high-frequency signal transmission is adversely affected
Solution Approach 1:
The patent applies parameter changes by precisely controlling the average particle diameter of copper particles (10-100 nm) and the 10-point average roughness (0.2-0.5 μm) to achieve optimal adhesive strength while maintaining low transmission loss. This quantitative parameter optimization resolves the contradiction between adhesive strength and high-frequency signal transmission
Solution Approach 2:
The patent uses composite materials by forming a surface-treated layer containing copper particles on the copper foil substrate, creating a composite structure that combines the adhesive benefits of roughened surface with the electrical conductivity of copper, thereby achieving both strong adhesion and low transmission loss
2Strength
If surface treatment is excessively performed to increase adhesive strength, then adhesive strength with resin is improved, but factors interfering with high-frequency signal transmission increase
Solution Approach 1:
The patent employs parameter changes by establishing specific ranges for surface treatment parameters: copper particle diameter (10-100 nm) and 10-point average roughness (0.2-0.5 μm). These controlled parameters ensure sufficient adhesive strength while minimizing signal transmission interference, avoiding the harmful effects of excessive treatment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a copper foil with enhanced adhesive strength and reduced signal transmission loss, making it suitable for high-frequency applications without interfering with signal transmission.
Implementation Method 1
a surface-treated layer formed on at least one side of an untreated copper foil
Implementation Method 2
an oxidation preventing layer formed on the surface-treated layer, wherein the oxidation preventing layer may contain nickel (Ni) and phosphorus (P)
Data Source
AI summary
Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 μm to about 0.5 μm and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.