Surface Treating Apparatus with Oblique Jetting for Uniform Substrate Coverage
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Solution Overview
Problem
Existing surface treatment methods, such as plating, face challenges with complexity and solution usage due to the need for lifting mechanisms and large solution volumes, and struggle to evenly treat the upper portions of substrates, leading to inefficiencies and uneven treatment.
Innovation Solution
A surface treatment device with a holding member that releases treatment solutions perpendicularly onto the substrate, utilizing a transferring mechanism to ensure even coverage and a curved or semi-circular design to guide the solution effectively, along with multiple holding members to manage solution flow between targets, preventing adhesion and ensuring uniform treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lifting mechanism is used to immerse the substrate in a plating bath, then surface treatment can be performed, but the device becomes complicated and enlarged
Solution Approach 1:
Instead of lifting the substrate into the plating bath, the invention inverts the approach by holding the substrate stationary and jetting the plating solution upward onto the substrate surface. This eliminates the need for lifting mechanisms while achieving the same surface treatment effect.
Solution Approach 2:
The invention extracts the essential function of surface treatment from the traditional immersion method. By using jet ports to deliver plating solution directly to the substrate surface, it separates the treatment function from the mechanical lifting mechanism, simplifying the overall device structure.
2Reliability
If a plating bath is filled with plating solution, then surface treatment can be performed, but a large quantity of plating solution is required
Solution Approach 1:
The invention extracts only the necessary amount of plating solution from the large plating bath and delivers it directly to the substrate surface through jet ports. This on-demand delivery system eliminates the need to fill and maintain a large plating bath, significantly reducing plating solution consumption.
Solution Approach 2:
The plating solution is circulated and reused within the system. The solution that flows down from the substrate is collected and pumped back to the jet ports for repeated application, creating a self-sustaining system that minimizes fresh solution requirements.
3Device complexity
If treatment solution is jetted to the substrate from jet ports, then device complexity is reduced, but the upper portion of the substrate cannot be subjected to surface treatment
Solution Approach 1:
The invention introduces dynamic movement to the previously static jetting system. The jet ports are moved along with the substrate during treatment, ensuring that the plating solution is continuously applied to all portions of the substrate surface, including the upper portions that would otherwise be missed.
Solution Approach 2:
The moving jet ports serve multiple functions: they deliver plating solution to the substrate surface, follow the substrate movement to ensure complete coverage, and maintain consistent treatment across all areas. This multi-functionality resolves the limitation of static jetting while keeping the device simple.
4Quantity of substance
If treatment solution is released to flow down on substrate surface, then solution usage is reduced, but the position of applied substrate varies due to non-constant releasing force
Solution Approach 1:
The invention incorporates feedback control through the moving jet ports that track substrate position. The system responds to substrate movement by adjusting jet port position accordingly, maintaining constant treatment application position despite variations in solution flow dynamics.
Solution Approach 2:
By making the jet ports movable and synchronized with substrate movement, the system dynamically adapts to maintain consistent application positioning. This dynamic adjustment compensates for variations in solution flow and ensures precise, repeatable treatment positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves efficient and uniform surface treatment of the upper portions of substrates with reduced solution usage and device complexity, preventing adhesion and ensuring consistent application across the entire surface.
Implementation Method 1
The treatment solution is jetted to the substrate 2 from the treatment solution jet port 10, and the treatment solution that has reached the substrate 2 flows down on a surface of the substrate 2
Data Source
AI summary
A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.