Surface Treatment Composition for Semiconductor Substrates
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Solution Overview
Problem
Current surface treatment compositions with basic compounds at a pH of 8 or more cause roughness and high haze levels on semiconductor substrates, hindering defect detection and control of nano-scale defects.
Innovation Solution
A surface treatment composition combining two surfactants with different molecular weights, where the second surfactant has a weight-average molecular weight one-half or less than the first, effectively controls etching action and reduces haze by adsorbing on the substrate surface to protect it from non-uniform etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a basic compound is added to the surface treatment composition to enhance etching and rinsing effects, then the rinsing or etching capability is improved, but surface roughness increases and haze is generated
Solution Approach 1:
The patent introduces a specific compound (having specific molecular weight and functional groups) as an intermediary substance that mediates between the basic compound and the substrate surface. This compound adsorbs onto the substrate surface and moderates the etching action of the basic compound, preventing excessive roughness while maintaining effective cleaning and rinsing capabilities.
Solution Approach 2:
The patent optimizes the molecular weight and concentration parameters of the added compound to achieve the desired balance. By controlling these parameters, the etching action is sufficiently suppressed to prevent haze formation, while the rinsing effectiveness is maintained through the basic compound's action.
2Productivity
If the pH of the surface treatment composition is increased to 8 or more to improve rinsing effect, then the rinsing capability is enhanced, but etching action causes surface roughness
Solution Approach 1:
The compound acts as a protective intermediary layer between the high-pH basic compound and the substrate. It allows the high pH environment necessary for effective rinsing while preventing the direct aggressive etching that would cause surface roughness and haze.
Solution Approach 2:
The patent creates a localized protective effect at the substrate surface through the adsorbed compound, while maintaining the overall high pH environment in the solution for effective rinsing. The protection is localized where needed (at the surface) without compromising the bulk solution's rinsing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition suppresses substrate surface roughness, reducing haze levels and enhancing the ability to control nano-scale defects, thereby improving defect detection and substrate quality.
Implementation Method 1
the second surfactant having a weight-average molecular weight one-half or less that of the first surfactant, and the sum of the content of the first surfactant and the content of the second surfactant being 0.00001 to 0.1% by mass
Data Source
AI summary
A surface treatment composition of the present invention contains a first surfactant, a second surfactant, a basic compound, and water. The surface treatment composition has a pH of 8 or more. The second surfactant has a weight-average molecular weight one-half or less that of the first surfactant. The sum of the content of the first surfactant and the content of the second surfactant is 0.00001 to 0.1% by mass.