Surface Treatment Liquid Prevents Pattern Collapse
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Solution Overview
Problem
The integration and miniaturization of semiconductor devices lead to pattern collapse during the drying process due to surface tension stress between adjacent patterns, which existing surface treatment liquids fail to adequately prevent.
Innovation Solution
A surface treatment liquid containing a water repellent agent and an acid imide is used to hydrophobize the substrate surface, increasing the contact angle of cleaning liquids and reducing the stress between patterns, thereby preventing pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning liquids or surface treatment liquids are used, then the cleaning process can be performed, but pattern collapse occurs due to surface tension forces during drying
Solution Approach 1:
The invention changes the surface energy parameters of the substrate by applying a surface treatment liquid containing a silylating agent. This treatment modifies the contact angle of subsequent cleaning liquids, reducing surface tension forces that cause pattern collapse during drying. The parameter change occurs at the substrate surface level, transforming the interaction between cleaning liquid and pattern structures.
Solution Approach 2:
The surface treatment liquid acts as an intermediary substance between the cleaning liquid and the substrate patterns. By applying this intermediate layer first, it modifies the surface properties to reduce the harmful surface tension effects of the cleaning liquid, thereby preventing pattern collapse without changing the cleaning liquid itself.
2Productivity
If the aspect ratio of etched patterns is increased for miniaturization, then device integration is improved, but pattern collapse becomes more severe
Solution Approach 1:
The invention applies a preventive surface treatment before the cleaning and drying steps. By pre-applying the silylating agent treatment, the surface is prepared in advance to resist the surface tension forces that would otherwise cause pattern collapse during the subsequent drying process, allowing high aspect ratio patterns to be maintained.
Solution Approach 2:
The surface treatment changes the contact angle parameter of the cleaning liquid on the substrate. This parameter change reduces the capillary forces and surface tension stress that act on high aspect ratio patterns during drying, enabling better manufacturing precision while maintaining high device integration levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The surface treatment liquid effectively prevents pattern collapse by enhancing hydrophobicity and reducing the force acting between patterns during drying, improving the yield and reliability of semiconductor devices.
Implementation Method 1
treating the surface of a pattern, such as a silicon pattern, with a surface treatment liquid containing a water repellent agent and an acid imide to hydrophobize the surface and increase the contact angle of a cleaning liquid
Implementation Method 2
the pattern collapse occurs during cleaning treatment after the formation of patterns by the surface tension of a cleaning liquid when the cleaning liquid is dried
Data Source
AI summary
A surface treatment liquid that can effectively prevent pattern collapse of, in particular, a silicon pattern and a surface treatment process using the surface treatment liquid. The surface treatment liquid contains a water repellent agent and an acid imide. The surface treatment process includes exposing a surface of a substrate to the surface treatment liquid to thereby hydrophobize the substrate surface.