Leaky Surface Wave Launcher for Wireless Package Sideband Testing
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Solution Overview
Problem
Current testing technologies for chip verification face challenges such as impedance mismatch between the package and test device, leading to increased design complexity, cost, and circuit footprint, and limited wireless coupling range, which complicates the verification of chip operations and manufacturing.
Innovation Solution
The implementation of leaky surface wave launchers, including monopole and dipole antenna elements, for near-field communication (NFC) coupling between the package and test device, allowing for wireless transmission and reception of sideband signals without impedance mismatch, thereby reducing circuit complexity and cost while enabling flexible communication schemes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional testing technologies are used for chip verification, then the chip can undergo verification tests, but impedance mismatch between package and test device increases design complexity, cost, and circuit footprint
Solution Approach 1:
The patent replaces traditional wired/mechanical testing connections with wireless communication. The package includes a wireless communication interface that enables wireless transmission of test signals between the test device and the chip, eliminating physical connectors and associated impedance matching circuits, thereby reducing circuit complexity and footprint while maintaining verification capability
Solution Approach 2:
The patent introduces a wireless communication interface as an intermediary between the test device and the chip. This interface includes transmit and receive antennas that mediate the signal transmission, eliminating the need for direct electrical connections and impedance matching networks, thus reducing circuit complexity while enabling reliable verification
2Reliability
If traditional wired testing is used, then verification can be performed, but wireless coupling range is limited which complicates verification of chip operations
Solution Approach 1:
The patent employs dynamic frequency tuning and adaptive modulation in the wireless communication interface. The system can dynamically adjust operating parameters to optimize coupling range and maintain signal integrity over varying distances, enabling reliable verification without being constrained by fixed coupling range limitations
Solution Approach 2:
The patent utilizes variable transmission power, adjustable frequency selection, and configurable data rates in the wireless communication interface. By changing these parameters, the system can adapt to different coupling distances and environmental conditions, extending effective verification range while maintaining signal quality and verification accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient verification testing with reduced circuit complexity and cost, allowing for longer wireless coupling distances and flexible communication schemes, such as broadcasting and multi-drop, while maintaining the integrity of chip operations.
Implementation Method 1
Near field wireless communication system for mother to package and package to package sideband digital communication
Implementation Method 2
Near field wireless communication system for mother to package and package to package sideband digital communication
Data Source
AI summary
A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.