Surface-Mount Waveguide Over Plated Slot for PCB Vertical Transitions

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Solution Overview

Problem

Printed circuit boards (PCBs) face challenges with vertical transitions due to high transmission loss and the need for precise and costly fabrication techniques, which can limit the power delivered to antennas or RF structures, and are often incompatible with low-cost materials.

Innovation Solution

A surface-mount waveguide assembly that utilizes a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another, reducing transmission loss and enabling low-cost PCB materials by eliminating the need for precise fabrication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional vertical transitions are used to transfer electromagnetic energy through the PCB, then power can be delivered to antennas on opposite sides, but transmission loss increases and power delivery efficiency decreases

Engineering Contradiction:
Improvetransmission lossVSAvoidpower delivered to antenna
Core Design Contradiction:
Loss of energyVSPower

Solution Approach 1:

A waveguide cavity is introduced as an intermediary component between the transmit and receive antennas. The cavity is positioned at a distance from both antennas and couples electromagnetic energy between them through its resonant modes, reducing direct path loss and improving power transfer efficiency

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution transitions from planar electromagnetic coupling to three-dimensional cavity resonator coupling. The waveguide cavity extends in the vertical dimension perpendicular to the PCB surface, creating a volumetric resonant structure that enables more efficient energy transfer compared to traditional planar transitions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If precise fabrication techniques (etching, imaging, layer alignment) are used to create vertical transitions, then transmission paths can be formed, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvevertical transition alignmentVSAvoidfabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The waveguide cavity is designed as a separate, modular component that can be manufactured independently of the PCB. This segmentation allows the cavity to be produced using simple casting or molding techniques without requiring precise etching or alignment operations on the PCB itself

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The waveguide cavity can be fabricated using low-cost materials and simple casting techniques rather than expensive precision manufacturing. The cavity serves as a disposable or replaceable component that enables vertical transitions without requiring high-precision PCB fabrication

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If conventional vertical transition fabrication is used, then electromagnetic energy transfer is enabled, but material costs increase due to requirements for specialized PCB materials

Engineering Contradiction:
Improveelectromagnetic energy transferVSAvoidPCB material cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The waveguide cavity acts as an intermediary that enables reliable electromagnetic energy transfer without requiring the PCB itself to be made from expensive specialized materials. The cavity handles the RF energy transfer functions, allowing the PCB to use standard, lower-cost materials

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution increases power delivery to antennas, reduces fabrication costs, and supports high bandwidth, making it compatible with low-cost materials while maintaining efficient electromagnetic energy transfer.

Implementation Method 1

surface-mount waveguide for vertical transitions of a printed circuit board

Methodology Applied
Scientific EffectWaveguide: Waveguide

Implementation Method 2

The waveguide cavity is configured to perform impedance matching of the EM energy while guiding the EM energy from the first surface to the second surface

Methodology Applied
Scientific EffectImpedance matching:

Implementation Method 3

a plated slot configured to channel an electromagnetic (EM) energy from a planar dimension in parallel with the first surface to a vertical dimension that is orthogonal to the planar dimension

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS11757166B2Surface-mount waveguide for vertical transitions of a printed circuit board
Publication Date: 2023.09.12 APTIV TECHNOLOGIES AG
  • US11757166B2 patent drawing
  • US11757166B2 patent drawing
  • US11757166B2 patent drawing

AI summary

Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups).