Surge Suppression Circuit Layout for Lower Capacitor Heating
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Solution Overview
Problem
Existing surge suppression devices with resistor-capacitor series circuits face issues with excessive temperature rise in capacitors due to heat transfer from resistors, leading to reduced capacitor lifespan.
Innovation Solution
A surge suppression device design that includes resistive elements, capacitors, terminals, fixing metal brackets, and mold resin, where capacitors are located away from the mold resin, and thermal paths are optimized to minimize heat transfer to capacitors using materials with varying thermal conductivities and structured mold resins to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the capacitor is placed close to the resistive element for compact design, then the device size is reduced, but the capacitor temperature rises excessively due to heat transfer from the resistor
Solution Approach 1:
The patent introduces mold resin as an intermediary substance between the resistive element and the capacitor. This mold resin has low thermal conductivity, acting as a thermal barrier that prevents heat transfer from the resistive element to the capacitor while still allowing the components to be positioned close together for compact design
Solution Approach 2:
The patent applies different thermal conductivity properties to different regions of the mold resin. The mold resin surrounding the resistive element has low thermal conductivity to block heat, while the mold resin in other areas maintains normal properties for structural support and insulation, creating localized thermal management
2Temperature
If the capacitor is positioned away from the mold resin to reduce heat transfer, then capacitor temperature rise is suppressed, but the device complexity increases due to additional structural considerations
Solution Approach 1:
The mold resin serves multiple functions simultaneously: it provides structural support for all components, acts as an electrical insulator, and functions as a thermal barrier when positioned between the resistive element and capacitor. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in device complexity
Solution Approach 2:
The patent combines the structural housing function with the thermal management function by making the mold resin both the enclosure material and the thermal barrier. This merging of functions eliminates the need for separate thermal insulation components, keeping the structure relatively simple while achieving temperature control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses capacitor temperature rise, prolongs capacitor life, and reduces the overall device size while maintaining efficient heat dissipation and connectivity.
Implementation Method 1
a mold resin to mold the resistive element, the terminal, and the fixing metal bracket, wherein the capacitor is located away from the mold resin
Implementation Method 2
the capacitor may receive heat from the resistor, causing an excessive temperature rise
Data Source
AI summary
A surge suppression device has a resistive element, a capacitor electrically connected to the resistive element, a terminal electrically connected to the opposite side of the resistive element to the side connected to the capacitor, a fixing metal bracket to be fixed to a fixing target, and a mold resin to mold the resistive element, the terminal and the fixing metal bracket. The capacitor is located away from the mold resin.