Surround Electrode Deposition for Light Emitting Element Arrays

The patent extracts and eliminates the photomask patterning process from the manufacturing flow. Instead of using a photomask to define the electrode pattern, the connection electrode is formed by direct deposition covering the entire substrate surface, then selectively removed in subsequent processing steps. This removes the source of alignment errors and eliminates photomask-related costs while maintaining the ability to create precise electrode patterns through alternative means.

The patent inverts the conventional approach by forming the connection electrode as a continuous layer first, then removing unnecessary portions rather than forming only the required pattern directly. This reverse methodology avoids the alignment issues inherent in direct photomask patterning while achieving the same functional result, and reduces costs by eliminating photomask fabrication and alignment steps.

The patent removes the divisional exposure process entirely from the manufacturing sequence. By forming the connection electrode as a continuous deposited layer without photomask patterning, the need for divisional exposure is eliminated, thereby preventing stitch defects and alignment issues that would otherwise occur when joining multiple exposed areas.

The patent performs the electrode formation as a preliminary continuous layer deposition before any pattern definition steps. This preliminary action creates a uniform base layer across the entire substrate area in a single step, avoiding the need for subsequent divisional exposure and the associated reliability issues with stitching and alignment.

The patent extracts the photomask patterning step from the process flow, replacing it with direct deposition followed by selective removal. This eliminates the time-consuming photomask alignment and exposure steps while maintaining positioning precision through alternative methods, thereby significantly improving production efficiency without sacrificing electrode placement accuracy.

The patent implements continuous deposition of the connection electrode material across the entire substrate in an uninterrupted process, rather than performing sequential patterning operations. This continuous action maximizes production efficiency by eliminating the stop-start nature of photomask-based patterning, while subsequent selective removal processes maintain the required positioning precision.