Susceptor Bushing Structure to Prevent Gas Hole Clogging

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Solution Overview

Problem

Existing susceptor manufacturing methods fail to prevent bonding agent penetration into cooling gas holes during the bonding process, leading to gas supply failures, particle generation, and arcing, particularly in high-power susceptors for high-aspect ratio contact processes.

Innovation Solution

Implementing a cap-type bushing structure or tube structure in the bonding process to prevent bonding agent penetration into gas flow paths, ensuring stable pressure resistance and fluid communication between the base substrate and insulating plate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an insulating bushing is inserted into the gas flow path to prevent bonding agent penetration, then bonding agent penetration is prevented, but the bushing is lifted due to thermal expansion during curing, making it impossible to completely prevent penetration

Engineering Contradiction:

Improveprevention of bonding agent penetrationVSAvoidcomplexity of bushing structure and process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a nested structure where the insulating bushing is placed within a groove formed in the insulating plate, and the bonding agent is applied in layers with the bushing embedded in the bonding agent. This nested arrangement constrains the bushing and prevents lifting during thermal expansion, while still maintaining the function of preventing bonding agent penetration into the gas flow path.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The groove is pre-formed in the insulating plate before the bonding process, and the insulating bushing is pre-inserted into the groove. This preliminary preparation ensures that when thermal expansion occurs during curing, the bushing is already constrained by the groove structure, preventing lifting and ensuring complete prevention of bonding agent penetration.

Inventive Principle:

Principle #10Preliminary action

2Strength

If bonding agent is applied to bond base substrate and insulating plate, then bonding is achieved, but bonding agent penetrates into gas flow path causing contamination and gas supply failure

Engineering Contradiction:

Improvebonding strengthVSAvoidcontamination and gas supply failure

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The insulating bushing acts as an intermediary element between the bonding agent and the gas flow path. It is inserted into the groove and embedded in the bonding agent, creating a barrier that prevents the bonding agent from penetrating into the gas flow path while still allowing strong bonding between the base substrate and insulating plate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding agent is applied in a localized manner around the insulating bushing rather than uniformly across the entire bonding surface. The bushing is embedded in the bonding agent at specific locations where gas flow path communication is needed, creating local quality control that prevents penetration at critical areas while maintaining overall bonding strength.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If adhesive film is applied on insulating plate before bonding, then bonding is facilitated, but adhesive film is lifted due to thermal expansion making it impossible to prevent bonding agent penetration

Engineering Contradiction:

Improveease of bonding processVSAvoidprevention of bonding agent penetration

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent extracts the adhesive film from the bonding process and replaces it with a groove structure in the insulating plate. The insulating bushing is inserted into this groove and embedded in the bonding agent, eliminating the need for adhesive film while maintaining ease of manufacture and ensuring reliable prevention of bonding agent penetration.

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS12606913B2Susceptor manufacturing method and susceptor manufactured by the same

Publication Date: 2026.04.21 MICOCERAMICS LTD

AI summary

The present disclosure relates to a method of manufacturing a susceptor. The present disclosure may provide a method of manufacturing a susceptor in which a cap-type bushing structure or tube structure is applied to a bonding structure of a base substrate and an insulating plate, so that the bonding structure can withstand or prevent the increase in pressure inside a gas flow path during a curing process, thereby preventing clogging of a gas hole in a high-power susceptor or the like for a high aspect ratio contact (HARC) processes, and minimizing the occurrence of arcing by reducing contamination around the gas hole. In addition, the present disclosure may also provide a susceptor manufactured by the method.