Susceptor Continuous Concavity Prevents Wafer Sliding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, the existing susceptor surface configurations can cause substrates to slide during process condition changes, leading to transfer errors and non-uniform film thicknesses due to gas release from concaves when pressure or gas flow rates change.
Innovation Solution
A substrate-supporting device with a top surface featuring continuous concavities connected by channels and through-holes, allowing gas flow and preventing substrate sliding by ensuring the susceptor's periphery always contacts the wafer, thereby inhibiting gas entry underneath.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the susceptor surface is processed with concaves to reduce foreign matter attachment and prevent substrate sticking, then cleaning effectiveness is improved, but substrate sliding occurs during process condition changes
Solution Approach 1:
The susceptor surface is divided into multiple independent contact regions (convex portions) separated by concave grooves. This segmentation allows the substrate to be supported at multiple discrete points, preventing sliding while maintaining the cleaning benefits of concave regions where foreign matters can collect without contacting the substrate
Solution Approach 2:
The susceptor surface is pre-processed with a specific convex-concave pattern before substrate processing. This preliminary structuring creates predetermined gas flow paths and contact regions that actively manage gas release during pressure changes, preventing substrate sliding before it can occur
2Ease of operation
If concaves are added to the susceptor surface to prevent substrate sticking, then substrate release is improved, but non-uniform film thickness occurs due to substrate sliding
Solution Approach 1:
The surface is segmented into convex contact portions and concave non-contact portions. The convex portions provide stable support points that maintain substrate position during film deposition, ensuring uniform thickness, while the concave portions facilitate substrate release by preventing sticking
Solution Approach 2:
The convex-concave surface structure acts as an intermediary between the substrate and the susceptor. It mediates the interaction by providing controlled contact points that prevent both sticking and sliding, thereby ensuring uniform film deposition while maintaining ease of substrate release
3Object-affected harmful factors
If the susceptor surface is made irregular with concaves and convexes to reduce foreign matter, then cleaning efficiency is improved, but substrate sliding occurs during cycle purge
Solution Approach 1:
Different regions of the susceptor surface have different properties: convex portions provide stable contact and position stability during purge, while concave portions collect foreign matters and facilitate cleaning. This local differentiation allows the surface to simultaneously achieve foreign matter reduction and position stability
Solution Approach 2:
The surface is segmented into functional zones with convex contact regions for stability and concave collection regions for cleaning. This segmentation allows the substrate to remain stable during purge operations while foreign matters are effectively managed in the concave regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents substrate sliding and foreign matter attachment, ensuring uniform film deposition and reducing transfer errors by managing gas flow and pressure changes within the reaction chamber.
Implementation Method 1
said continuous concavity being adapted to allow gas to flow in the continuous concavity and through the through-hole under a substrate placed on the top surface
Implementation Method 2
the susceptor surface is sometimes processed for the purposes of reducing foreign matters attaching to the back of the substrate, preventing the substrate from sticking
Implementation Method 3
Transfer errors occurring when the substrate is transferred out after the film forming process, and non-uniform film thicknesses, have been reported due to this sliding
Data Source
AI summary
A substrate-supporting device has a top surface for placing a substrate thereon composed of a plurality of surfaces separated from each other and defined by a continuous concavity being in gas communication with at least one through-hole passing through the substrate-supporting device in its thickness direction. The continuous concavity is adapted to allow gas to flow in the continuous concavity and through the through-hole under a substrate placed on the top surface.