Susceptor Cover Through-Hole Design for Temperature Uniformity
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Solution Overview
Problem
In substrate processing for semiconductor devices, a local temperature drop occurs on the substrate surface above holes in the susceptor cover, leading to inadequate heating and reduced temperature uniformity, particularly due to the design of through-holes and lift pins in the susceptor and susceptor cover.
Innovation Solution
The substrate processing apparatus includes a susceptor with first through-holes avoiding the heating element and a susceptor cover with second through-holes of greater diameter, allowing for improved heat distribution and preventing local temperature drops by ensuring direct and indirect radiation can reach the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the susceptor cover is provided with a hole communicating with the through-hole of the susceptor for substrate elevation, then the substrate can be lifted after processing, but the heat from the susceptor cover cannot be conducted to the substrate and local temperature drop occurs
Solution Approach 1:
The susceptor cover is designed with different thermal conductivity regions: a first region with higher thermal conductivity and a second region with lower thermal conductivity. This local quality differentiation allows the first region to effectively conduct heat to the substrate while the second region permits substrate elevation through the through-hole, thus resolving the contradiction between heat conduction and substrate lifting operations.
Solution Approach 2:
The susceptor cover is segmented into functionally distinct regions: a heating portion (first region) that conducts heat and a lifting portion (second region) that allows substrate elevation. This segmentation enables each region to perform its specific function optimally without interfering with the other, solving the contradiction between maintaining temperature uniformity and enabling substrate removal.
2Device complexity
If the hole in the susceptor cover has the same diameter as the through-hole in the susceptor, then the structure is simple, but the temperature distribution on the substrate surface becomes non-uniform
Solution Approach 1:
The susceptor cover employs local quality differentiation by creating a first region with higher thermal conductivity and a second region with lower thermal conductivity. This allows different parts of the cover to have different functions: the first region maintains temperature uniformity through effective heat conduction, while the second region accommodates the lifting operation. This resolves the contradiction between structural simplicity and temperature distribution uniformity.
3Loss of energy
If the susceptor cover fully covers the susceptor surface, then heat conduction is maximized, but substrate elevation through through-holes becomes difficult
Solution Approach 1:
The susceptor cover is segmented into a first region that covers and conducts heat to the substrate, and a second region that is positioned at the through-hole location to allow substrate elevation. This segmentation enables the cover to maintain extensive coverage for heat conduction while providing localized openings for substrate removal, thus resolving the contradiction between heat retention and ease of substrate elevation.
Solution Approach 2:
The susceptor cover acts as an intermediary structure that bridges the heating function and the elevation function. By incorporating a second region with lower thermal conductivity at the through-hole location, it mediates between the need for heat conduction (first region) and substrate elevation (second region), allowing both functions to coexist without conflict.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform temperature distribution on the substrate surface, preventing local temperature drops and enhancing the uniformity of substrate processing, such as film formation, by adjusting the diameter and arrangement of through-holes in the susceptor and susceptor cover.
Implementation Method 1
a susceptor heater configured to heat the susceptor
Implementation Method 2
the heat generated by the susceptor heated by a heater is conducted to the susceptor cover to heat the substrate
Implementation Method 3
ensuring direct and indirect radiation can reach the substrate surface
Data Source
AI summary
According to one aspect of the technique in the disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is accommodated; a susceptor configured to support the substrate in the process chamber; and a susceptor cover provided on an upper surface of the susceptor, wherein the susceptor includes: a heating element; and a first through-hole located so as to avoid the heating element, and the susceptor cover includes a second through-hole communicating with the first through-hole and having a diameter greater than a diameter of the first through-hole.