Adhesive-Free Susceptor Assembly for Clean Gas Channel Insulation
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Solution Overview
Problem
Existing susceptor designs in substrate processing apparatuses face issues with adhesive vaporization causing arcing and contamination in gas channels, leading to substrate deterioration and reduced withstand voltage function due to adhesive interfaces.
Innovation Solution
A susceptor design that couples a filter to a bush using co-sintering without an adhesive, integrating the filter and bush as a single ceramic body, and couples the susceptor to a base plate with an adhesive, eliminating heterogeneous interfaces and adhesive-related issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an adhesive is used to bond the filter to the bush or couple the ESC to the base plate, then the components can be easily assembled, but the adhesive vaporizes causing arcing in the gas channel and contamination
Solution Approach 1:
The invention extracts and removes the adhesive from the bonding process. Instead of using adhesive to bond the filter to the bush or the ESC to the base plate, the patent employs direct sintering or mechanical coupling methods that eliminate the adhesive layer entirely, thereby preventing adhesive vaporization and arcing in the gas channel
Solution Approach 2:
The invention replaces the chemical bonding mechanism (adhesive) with a physical/structural bonding mechanism (direct sintering or mechanical coupling). This substitution eliminates the organic adhesive material that causes vaporization, while maintaining the structural integrity and bonding function through ceramic sintering or precision mechanical interfaces
2Strength
If an adhesive layer is used to couple elements, then bonding is achieved, but the interface layer forms gaps that hinder withstand voltage function enhancement
Solution Approach 1:
The invention extracts and eliminates the adhesive interface layer that creates gaps. By removing the adhesive entirely and using direct sintering or mechanical coupling, the patent eliminates the source of interface gaps that compromise withstand voltage performance
Solution Approach 2:
The invention merges the bonded components into a more integrated structure. Through direct sintering, the filter and bush become part of the same ceramic body, and the ESC and base plate are coupled with direct contact, eliminating the adhesive interface and creating a more unified, gap-free structure that enhances withstand voltage function
3Ease of manufacture
If adhesive is used to bond components, then assembly is simplified, but vaporized adhesive components contaminate the gas channel and substrate
Solution Approach 1:
The invention extracts and removes the adhesive material from the assembly process. By eliminating the adhesive layer, there is no organic material to vaporize and contaminate the gas channel or substrate, while assembly simplicity is maintained through direct sintering or mechanical coupling methods
Solution Approach 2:
The invention creates an inert environment by using ceramic materials and sintering processes that do not produce contaminating vapors. The ceramic-based construction and high-temperature sintering create a chemically stable system that prevents contamination of the gas channel and substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces arcing and contamination, enhances withstand voltage function, and simplifies production by integrating the filter and bush as a single ceramic body, thus preventing adhesive vaporization and interface gaps.
Implementation Method 1
The forming of the bush-filter assembly may include converting the filter preform into a porous sintered body by removing the pore former in the filter preform
Implementation Method 2
The forming of the bush-filter assembly may include converting the bush preform into a dense sintered body including no pores
Implementation Method 3
forming the bush-filter assembly which is an integrated sintered body in which a filter is sinter-bonded to a bush in the filter accommodation part, by accommodating the filter preform in the filter accommodation part of the bush preform and performing co-sintering
Data Source
AI summary
A method of manufacturing a susceptor includes preparing an electrostatic chuck (ESC) and a base plate, each including a gas channel, preparing a bush-filter assembly disposed between the gas channel in the ESC and the gas channel in the base plate, and coupling the ESC to the base plate in such a manner that a portion of the bush-filter assembly is accommodated in a first accommodation part formed in a surface of the ESC and that a remaining portion of the bush-filter assembly is at least partially accommodated in a second accommodation part formed in a surface of the base plate.