Susceptor Gap Control Using In-Situ Optical Measurement

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing semiconductor processing techniques require an iterative and time-consuming process to adjust the gapping and spacing between the susceptor and the pre-heat ring, which can lead to contamination and limited temperature control, resulting in inconsistent deposition processes and material waste.

Innovation Solution

Implementing a dynamic adjustment system using detectors like lasers or cameras to measure gapping and spacing in real-time, with a control system instructing motors to make precise adjustments, allowing for in-situ adjustments without disturbing the vacuum, enabling more accurate and rapid temperature control during deposition processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If iterative manual adjustment of gapping and spacing is used, then manufacturing precision can be achieved, but production time increases and contamination risk increases

Engineering Contradiction:
Improvegapping and spacing precisionVSAvoidadjustment time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent replaces manual mechanical adjustment with an automated motor-driven positioning system. Motors are integrated into the susceptor assembly to dynamically adjust gapping and spacing between the susceptor and pre-heat ring, eliminating the need for iterative manual adjustments while maintaining precision control throughout the deposition process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent implements a feedback control system using detectors (such as lasers or cameras) to measure gapping and spacing in real-time. The control system receives detector input and automatically adjusts motor positions to maintain optimal parameters, enabling closed-loop control that ensures manufacturing precision without time-consuming manual iterations.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If iterative adjustment process is used, then manufacturing precision can be achieved, but contamination increases

Engineering Contradiction:
Improvegapping and spacing precisionVSAvoidcontamination
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent performs preliminary measurement and adjustment of gapping and spacing parameters before the deposition process begins. The motor positioning system pre-configures optimal parameters based on stored data or real-time measurements, eliminating the need for adjustments during the process that would compromise the vacuum environment and introduce contamination.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The automated motor-driven system eliminates manual intervention during deposition, replacing iterative mechanical adjustments with a single initial configuration. This prevents contamination by keeping the vacuum environment undisturbed throughout the process while maintaining precision through automated control.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If dynamic adjustment system with detectors and motors is implemented, then temperature control precision improves, but device complexity increases

Engineering Contradiction:
Improvetemperature control precisionVSAvoidadjustment system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent integrates multiple functions into unified components: the motor system simultaneously controls both gapping and spacing parameters, the detectors serve both measurement and feedback control functions, and the control system manages both positioning and temperature regulation. This multi-functionality reduces overall system complexity despite the advanced capabilities provided.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system performs self-adjustment through automated feedback control. The detectors continuously monitor gapping and spacing, and the control system automatically commands motor adjustments without external intervention. This self-service capability simplifies operation and reduces the need for complex external control mechanisms.

Inventive Principle:
Principle #25Self-service

4Productivity

If in-situ adjustments are made without disturbing vacuum, then productivity improves, but measurement precision becomes more difficult

Engineering Contradiction:
Improvedeposition process efficiencyVSAvoidgapping and spacing measurement
Core Design Contradiction:
ProductivityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent replaces physical mechanical measurement methods with non-contact optical detection. Lasers or cameras measure gapping and spacing parameters through the vacuum environment without requiring physical access or disturbance of the vacuum, enabling accurate in-situ measurements that maintain both productivity and measurement precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces optical intermediaries (lasers or cameras) that can transmit measurement signals through the vacuum environment. These intermediaries enable measurement without direct physical contact or vacuum disturbance, solving the conflict between maintaining vacuum integrity and achieving accurate measurements during deposition.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces production time, minimizes material waste, and decreases the likelihood of contamination, leading to more consistent epitaxial growth and reduced wafer damage, thereby improving the efficiency and quality of semiconductor processing.

Implementation Method 1

a pre-heat ring that surrounds the susceptor and that is configured to heat the wafer

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

a motor configured to move the susceptor vertically, laterally, or a combination thereof

Methodology Applied
Scientific EffectElectromagnetic force: Electromagnet

Data Source

PatentUS20240379398A1Semiconductor processing tool and method of operation
Publication Date: 2024.11.14 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240379398A1 patent drawing
  • US20240379398A1 patent drawing
  • US20240379398A1 patent drawing

AI summary

In some implementations, a control device may determine a spacing measurement in a first dimension between a wafer on a susceptor and a pre-heat ring of a semiconductor processing tool and/or a gapping measurement in a second dimension between the wafer and the pre-heat ring, using one or more images captured in situ during a process by at least one optical sensor. Accordingly, the control device may generate a command based on a setting associated with the process being performed by the semiconductor processing tool and the spacing measurement and/or the gapping measurement. The control device may provide the command to at least one motor to move the susceptor.