Susceptor Position Correction for Electromagnetic Wave Substrate Processing
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Solution Overview
Problem
Conventional electromagnetic wave-based substrate processing methods for semiconductor devices face productivity degradation due to the need for a cooling step after high-temperature heat treatment, and suffer from susceptor position changes that affect process reproducibility.
Innovation Solution
A substrate processing apparatus with a process chamber, electromagnetic wave supply, substrate holding with susceptors to prevent wave absorption, and a controller for susceptor position correction, allowing efficient cooling and maintaining reproducibility by optimizing susceptor positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling step is provided after electromagnetic wave-based heat treatment, then substrate temperature is controlled, but productivity deteriorates
Solution Approach 1:
The patent combines the cooling function with the susceptor by forming a heat-conductive layer on the susceptor that directly contacts the substrate. This integration allows heat transfer from the substrate to the susceptor during the electromagnetic wave processing, eliminating the need for a separate cooling step and maintaining productivity while controlling substrate temperature.
Solution Approach 2:
The heat-conductive layer acts as an intermediary between the substrate and the susceptor, enabling efficient thermal transfer. This intermediary structure allows the susceptor to serve dual purposes: maintaining electromagnetic field uniformity and providing cooling functionality through thermal conduction during the processing operation.
2Manufacturing precision
If susceptor is used to suppress electromagnetic wave absorption, then substrate processing uniformity is improved, but susceptor position changes affect process reproducibility
Solution Approach 1:
The patent performs preliminary position correction of the susceptor using the substrate transfer part before the actual electromagnetic wave processing begins. This preliminary action ensures the susceptor is in the correct position for reproducible processing, preventing position-related variations in subsequent operations.
Solution Approach 2:
The system incorporates position detection and feedback control for the susceptor. The substrate transfer part detects susceptor position and makes corrective adjustments, creating a closed-loop control system that maintains consistent susceptor positioning and ensures process reproducibility across multiple processing cycles.
3Manufacturing precision
If electromagnetic wave heat treatment is applied to high-density substrate, then modifying process is achieved, but edge effect causes non-uniform heating
Solution Approach 1:
The susceptor with heat-conductive layer serves as an intermediary thermal management system between the electromagnetic wave energy and the substrate. It absorbs excess heat and redistributes it uniformly, preventing edge effects and ensuring even temperature distribution across the substrate surface during high-density processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances productivity by efficient cooling and maintains process reproducibility by correcting susceptor positions, thereby improving the substrate processing efficiency and consistency.
Implementation Method 1
a heat treatment method using an electromagnetic wave has been studied
Implementation Method 2
at least one susceptor for suppressing the electromagnetic wave from being adsorbed to an edge of the at least one substrate
Data Source
AI summary
According to one aspect of technique described herein, there is provided a technique including; a process chamber in which at least one substrate is processed; an electromagnetic wave supply part configured to supply an electromagnetic wave to the at least one substrate; a substrate holding part configured to hold the at least one substrate and at least one susceptor for suppressing the electromagnetic wave from being adsorbed to an edge of the at least one substrate; a substrate transfer part configured to transfer the at least one substrate; and a controller configured to control the substrate transfer part so as to correct a position of the at least one susceptor.