Susceptor Ring Injector Gas Flow Uniformity

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Solution Overview

Problem

Existing gas-phase reactor systems face challenges in controlling film properties such as thickness and composition, particularly at the outer edges of substrates during epitaxial deposition, leading to non-uniformity and issues like roll-up and roll-down.

Innovation Solution

The implementation of a susceptor ring assembly with injector tubes and ports disposed on a susceptor ring, allowing for controlled gas injection with specific angles and apertures to achieve desired flow profiles, thereby improving uniformity and reducing film non-uniformity at the substrate edges.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If typical gas injection methods are used, then the deposition process can be performed, but film uniformity at the far edge of the substrate deteriorates due to roll-up and roll-down issues

Engineering Contradiction:
Improvefilm uniformityVSAvoidcontrol difficulty
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The gas injection system is segmented into multiple independent injection zones along the substrate radius. Injector tubes are positioned at different radial locations with independent gas flow control, allowing separate optimization of gas delivery to the far edge region versus the center region, thereby resolving the uniformity control difficulty

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate receive tailored gas injection characteristics. The far edge region receives enhanced gas flow through specifically positioned injector tubes with optimized aperture angles, while other regions maintain standard injection parameters, creating locally optimized deposition conditions that eliminate roll-up and roll-down defects

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If gas injection is increased to improve film deposition at the far edge, then film thickness can be enhanced, but non-uniformity increases due to roll-up and roll-down effects

Engineering Contradiction:
Improvefilm thicknessVSAvoidfilm uniformity
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The system employs dynamic control of gas flow rates to each injector tube based on real-time deposition monitoring. Gas flow to far edge injectors is independently adjusted during the deposition process to maintain uniform film thickness, allowing the system to adaptively compensate for edge effects without sacrificing overall uniformity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

Injection parameters such as gas flow rate, aperture angle, and injector tube positioning are specifically optimized for far edge deposition. By changing these parameters locally at the injector tubes serving the far edge region, the system achieves improved film thickness and uniformity simultaneously, resolving the contradiction between quantity and precision

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables more precise control over film deposition, reducing roll-up and roll-down issues and enhancing the uniformity of film thickness and composition, particularly at the outer edges of substrates.

Implementation Method 1

gas injection utilizing an injector tube and injector port disposed on a susceptor ring... provide for more control or facilitate obtaining a desired flow profile

Methodology Applied
Scientific EffectGas flow:

Implementation Method 2

susceptor to retain and heat a substrate... deposit epitaxial layers on a substrate

Methodology Applied
Scientific EffectThermal heating: Heating

Data Source

PatentUS20240071804A1Method, assembly and system for gas injection and control
Publication Date: 2024.02.29 ASM IP HLDG BV
  • US20240071804A1 patent drawing
  • US20240071804A1 patent drawing
  • US20240071804A1 patent drawing

AI summary

Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a peripheral region of a substrate. Methods, systems, and assemblies can be used to obtain desired (e.g. composition and/or thickness) profiles of material on a substrate surface.