Susceptor Design for Thin Substrate Transfer Uniformity
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Solution Overview
Problem
The challenge lies in improving the handling of thinner substrates and achieving uniformity in processes such as rapid thermal processing, especially as component sizes shrink and substrate fragility increases.
Innovation Solution
The proposed solution involves a processing system with a susceptor that supports the substrate during transfer between chambers, eliminating the need for holes or plugs that can cause non-uniformities and damage. This system includes a first chamber with a susceptor and heating lamps, and a second chamber with robots and lift pins for substrate handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If substrates are made thinner to accommodate smaller components, then device integration is improved, but substrate handling becomes more difficult and substrates become more fragile
Solution Approach 1:
A susceptor is introduced as an intermediary support structure between the substrate and the processing chamber. The susceptor has a first surface that contacts the substrate and a second surface that contacts lift pins, providing mechanical support to fragile thin substrates during transfer and processing operations
Solution Approach 2:
The substrate is supported from below by the susceptor rather than only from above by lift pins. This adds a dimensional aspect of support from the substrate's bottom surface, distributing mechanical loads and reducing stress on the thin substrate material
2Ease of operation
If holes or plugs are used in susceptors to support substrates, then substrate handling is enabled, but non-uniformities and damage to substrates occur
Solution Approach 1:
The harmful holes and plugs are completely removed from the susceptor design. The susceptor is made as a solid structure without any openings, eliminating the source of non-uniformities and substrate damage while maintaining effective substrate support through the solid first surface contact
Solution Approach 2:
The susceptor provides localized support exactly where needed - on the first surface that contacts the substrate - rather than using distributed holes. This concentrated support area ensures uniform thermal and mechanical properties across the susceptor structure
3Device complexity
If substrates are transferred without additional support, then device complexity is reduced, but thermal uniformity and process consistency deteriorate
Solution Approach 1:
The susceptor serves multiple functions simultaneously: it supports the substrate mechanically during transfer, provides thermal conduction for uniform heating, and acts as a interface between the substrate and the lift pin positioning system. This multi-functionality is achieved without significantly increasing system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the handling and processing of thinner substrates by providing additional support during transfer and processing, reducing the risk of damage and non-uniformities, and improving thermal uniformity across the substrate.
Implementation Method 1
a plurality of heating lamps positioned over the edge ring
Implementation Method 2
a first cooling plate
Data Source
AI summary
A processing system is provided including a first chamber and a second chamber. The first chamber includes: a chamber body enclosing an interior volume; an edge ring having a top and a bottom, the edge ring including a first ledge extending inwardly from the top and a second ledge extending inwardly relative to the first ledge. The first ledge is configured to support a substrate and the second ledge is configured to support a susceptor. The first chamber further includes a plurality of heating lamps positioned over the edge ring. The second chamber includes: a chamber body enclosing an interior volume; a first cooling plate; one or more robots in the interior volume of the second chamber, the one or more robots having one or more end effectors positioned over the first cooling plate; and a plurality of lift pins extending through the first cooling plate.