Susceptor Assembly with Zone Heating and Unified Cooling
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Solution Overview
Problem
Existing substrate processing apparatuses struggle to maintain uniform temperatures at the center and periphery of a substrate due to differences in cooling fluid flow speeds and rates, leading to ineffective process performance as temperature deviations accumulate over time.
Innovation Solution
A susceptor assembly with integrated zone heaters and a single cooling path between them, along with a mechanism to levitate the substrate using levitational gas, ensuring uniform temperature control and rapid temperature transitions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate cooling passages are provided at the center and periphery of the susceptor, then cooling capability is improved, but temperature uniformity deteriorates due to differences in cooling fluid flow speeds and rates
Solution Approach 1:
The patent merges the separate cooling passages for the center and periphery into a single integrated cooling passage. This allows the cooling fluid to flow uniformly through the entire susceptor structure, eliminating the temperature differences that arose from having separate passages with different flow characteristics. The single passage design ensures consistent cooling performance across both center and periphery regions.
2Speed
If the substrate is heated rapidly by contact with the susceptor, then heating speed is improved, but temperature control precision deteriorates due to difficulty in maintaining constant temperatures
Solution Approach 1:
The patent segments the heating function by providing multiple independent heating zones (first heating zone at the center, second heating zone at the periphery) with separate heating controls. This allows independent temperature regulation in different regions, enabling rapid heating while maintaining precise temperature control and uniformity across the substrate surface.
Solution Approach 2:
The patent implements dynamic temperature control by allowing the cooling fluid flow rate to be adjusted based on process requirements. The system can dynamically switch between rapid cooling (when substrate temperature needs to be reduced quickly) and uniform cooling (when temperature uniformity is prioritized), providing flexible adaptation to different process stages.
3Adaptability or versatility
If multiple heating zones are provided with separate controls, then temperature control flexibility is improved, but device complexity increases
Solution Approach 1:
The patent achieves multi-functional temperature control through a single integrated cooling passage that serves multiple purposes: it cools both heating zones simultaneously, provides uniform temperature distribution, and allows flexible flow rate adjustment. This universal cooling system works effectively regardless of which heating zone is active, simplifying the overall control architecture while maintaining flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains consistent substrate temperatures and enables rapid temperature adjustments by floating the substrate, enhancing process efficiency and effectiveness.
Implementation Method 1
a cooling path disposed between the zone heaters and configured to allow cooling fluid to flow therethrough to cool the substrate
Implementation Method 2
a susceptor on which the substrate is seated, the susceptor being configured to cool or heat the substrate and to supply levitational gas toward the substrate
Data Source
AI summary
A susceptor assembly is configured to support a substrate and to regulate a temperature of the substrate. The susceptor assembly comprises a susceptor on which the substrate is seated. The susceptor is configured to cool or heat the substrate and to supply levitational gas toward the substrate. A substrate processing apparatus is provided to include the susceptor assembly, along with a chamber forming a processing space for the substrate and a gas supply unit provided in the chamber to supply process gas toward the substrate.