Suspended Glass Structures for Compact Sensor Integration
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Solution Overview
Problem
Current electronic packages face challenges in integrating sensors due to bulky silicon-based MEMS sensors, high aspect ratio via openings in glass cores that are difficult to fill, and costly, power-hungry electrical interconnects for data transmission.
Innovation Solution
The use of laser-assisted glass etching processes to create suspended structures and fully fill high aspect ratio vias with a bottom-up deposition process, enabling compact, low-cost sensor integration and efficient data transmission through optical means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lateral plating is used to fill high aspect ratio via openings, then the via openings can be filled with conductive material, but seams and voids are formed at the center of the via openings
Solution Approach 1:
Instead of plating from the top surface downward into high aspect ratio vias (which creates seams and voids), the patent inverts the approach by first forming a sacrificial layer at the bottom of the via, then plating upward from that base. This bottom-up plating approach eliminates the seam formation problem that occurs with conventional top-down lateral plating methods.
Solution Approach 2:
The patent introduces a sacrificial layer as an intermediary element at the bottom of the via opening. This sacrificial layer serves as a foundation for bottom-up plating, allowing conductive material to be deposited uniformly without forming seams or voids. After plating, the sacrificial layer is removed, leaving a clean via fill.
2Reliability
If silicon-based MEMS sensors are used, then sensing functionality is achieved, but the sensors become bulky and require external packaging and assembly
Solution Approach 1:
The patent merges the sensor functionality directly into the package substrate by forming suspended structures within the glass core itself. Instead of using separate silicon-based MEMS sensors that require external packaging and assembly, the sensing elements are integrated into the substrate, eliminating the need for discrete sensor components and reducing overall device volume.
Solution Approach 2:
The patent transitions from three-dimensional bulky silicon-based MEMS sensors to two-dimensional suspended structures formed within the plane of the package substrate. By using laser-assisted glass etching to create through-holes and forming conductive structures within the substrate plane, the sensor functionality is achieved with dramatically reduced vertical height and overall volume.
3Speed
If electrical interconnects are used for data transmission, then data transfer is achieved, but power consumption and cost increase at high data rates
Solution Approach 1:
The patent replaces electrical interconnects with optical waveguides for data transmission. Instead of using electrical signals that require copper traces and consume significant power at high data rates, the invention uses optical signals transmitted through waveguides formed in the glass core, eliminating resistive losses and reducing power consumption while enabling higher data rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of compact, low-cost sensors and efficient data transmission by eliminating seams and voids in vias, reducing power consumption, and enhancing the form factor and reliability of electronic packages.
Implementation Method 1
exposing a core to a laser, wherein the core comprises glass, and wherein the laser exposure creates an exposed region of the core
Implementation Method 2
filling high aspect ratio vias with a bottom-up deposition process
Data Source
AI summary
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core. In an embodiment, the core comprises glass. In an embodiment, a blind via is provided into the core. In an embodiment, a plate spans across the blind via.