Suspended Membrane Sensor Anchors for IC Integration
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Solution Overview
Problem
Existing methods for forming miniature environmental sensors, such as temperature, humidity, and pressure sensors, face challenges in creating free-standing structures with membranes separated from the base by more than four microns, which limits sensor size and integration with integrated circuits on a single die, resulting in larger device packages.
Innovation Solution
A method of forming sensors with a suspended membrane supported by consistently spaced and shaped anchors, where a plurality of openings are etched to form a chamber, allowing for increased distance between electrodes and integration of cavities to support a larger membrane area, enabling sensors to be fabricated on a single substrate with integrated circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If free standing structures are formed using conventional epitaxial layer removal methods, then sensors can be fabricated, but the membrane separation distance is limited to less than four microns
Solution Approach 1:
The support substrate is divided into multiple discrete anchors that are spatially separated, allowing the membrane to be suspended at greater heights between the base and the membrane while maintaining structural support. This segmentation enables the membrane separation distance to exceed four microns by distributing support points rather than requiring continuous support structure.
Solution Approach 2:
The invention transitions from planar sensor fabrication to three-dimensional suspended structures by forming anchors at different vertical levels and creating a suspended membrane that extends in the vertical dimension. This dimensional transition allows greater membrane separation distance while maintaining manufacturability through vertical anchoring structures.
2Area of stationary object
If sensors are fabricated on separate substrates or separate dies, then manufacturing flexibility is maintained, but device package size and footprint increase
Solution Approach 1:
The invention merges the sensor fabrication process with integrated circuit fabrication by forming both the suspended membrane sensor structures and the integrated circuits on the same substrate. This consolidation eliminates the need for separate substrates or dies, reducing device package size and footprint while maintaining manufacturing feasibility through unified process integration.
Data Source
AI summary
The present disclosure is directed to a device that includes a substrate and a sensor formed on the substrate. The sensor includes a chamber formed from a plurality of integrated cavities, a membrane above the substrate, the membrane having a plurality of openings, each opening positioned above one of the cavities, and a plurality of diamond shaped anchors positioned between the membrane and the substrate, the anchors positioned between each of the cavities. A center of each opening is also a center of one of the cavities.