Suspended MEMS Functional Frames for Precise Micro-Transfer Assembly
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Solution Overview
Problem
Existing methods for assembling micro-electro-mechanical systems (MEMS) components are limited by large component sizes, poor alignment accuracy, limited component types, and poor source material utilization, hindering the development of smaller, more integrated, and portable electronic systems.
Innovation Solution
The use of micro-transfer printing to integrate micro-system structures, comprising a frame and a component connected by cantilever supports, allowing for the transfer of micro-devices onto a target substrate with a suspended configuration, enabling smaller and more densely integrated systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional assembly methods (pick-and-place, die bonding) are used to assemble MEMS components on substrates, then components can be integrated into electronic systems, but the component sizes remain large, alignment accuracy is poor, and source material utilization is inefficient
Solution Approach 1:
The invention segments the assembly process into two distinct stages: (1) wafer-level parallel fabrication of multiple components on a source wafer, and (2) individual component transfer to the target substrate. This segmentation enables high-precision alignment during the fabrication stage using standard photolithography, while the transfer stage uses controlled release and pick-up mechanisms that maintain alignment without requiring complex real-time positioning during assembly.
Solution Approach 2:
The invention performs preliminary actions by pre-fabricating multiple components in parallel on a source wafer using standard semiconductor manufacturing processes before transfer. The components are prepared with release structures and alignment features in advance, allowing precise positioning to be established during fabrication rather than during the actual assembly process, thereby improving both precision and manufacturing efficiency.
2Volume of moving object
If smaller and more densely integrated components are used, then system size, weight, and cost are reduced, but conventional assembly methods cannot achieve the required precision and integration density
Solution Approach 1:
The invention transitions from two-dimensional planar assembly to three-dimensional suspended structures by releasing components from the source wafer plane and positioning them over cavities in the target substrate. This dimensional change enables smaller footprint designs while maintaining alignment precision through vertical positioning control during the pick-up and placement process, allowing dense integration without sacrificing manufacturing accuracy.
3Strength
If components are solidly mounted or anchored on substrates, then structural support is provided, but system volume and weight increase, reducing portability
Solution Approach 1:
The invention extracts the structural support function from the substrate plane by releasing components from full contact with the substrate and suspending them over cavities. The components retain necessary mechanical support through controlled anchoring at specific points while the suspended portions provide the required structural integrity, thereby reducing overall system volume and weight while maintaining adequate strength through optimized support geometries.
Data Source
AI summary
According to embodiments of the present disclosure, a micro-system comprises a frame, a component attached to and supported by the frame, and an electrically functional micro-device disposed on or in the frame and electrically connected to the component. The component can be exclusively supported by the frame. The frame can comprise the micro-device and can comprise the same materials and layer structure as the component. The component, frame, and micro-device can comprise a piezoelectric material. The component can be an acoustic resonator and the micro-device can be a capacitor.