Suspended Resonator Structure for Low-Deformation UHF Operation
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Solution Overview
Problem
Thin flat resonator chips used in ultra-high frequency applications have low structural rigidity and are prone to excessive deformation under mechanical or inertia forces, risking contact with adjacent components.
Innovation Solution
A suspended resonator design featuring a vibration structure with a thickening portion surrounding the central part of the plate portion, enhancing structural rigidity and strength, and a connecting portion that connects the thickening portion with a frame portion, reducing deformation during vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the resonator chip thickness is reduced to achieve ultra-high frequency resonance, then the resonance frequency is improved, but the structural rigidity and strength deteriorate, causing excessive deformation under mechanical or inertia forces
Solution Approach 1:
The patent applies local quality by creating a thickening portion at specific locations (edge parts and central part) of the vibration structure, while keeping other areas thin. This localized thickness variation enhances structural rigidity where needed without increasing the overall chip thickness, thereby maintaining ultra-high frequency resonance capability while preventing excessive deformation under mechanical or inertia forces
Solution Approach 2:
The patent transitions from a two-dimensional thin plate structure to a three-dimensional structure by adding a thickening portion that protrudes from the surface. This dimensional change allows the vibration structure to gain structural strength and rigidity in the thickness direction without compromising the overall thin profile needed for high-frequency resonance
2Speed
If the resonator chip thickness is reduced to achieve ultra-high frequency resonance, then the resonance frequency is improved, but the risk of hitting adjacent components increases due to excessive deformation
Solution Approach 1:
The thickening portion is strategically positioned at the edge parts and central part of the vibration structure to provide localized reinforcement. This reduces deformation in critical areas during vibration, preventing contact with adjacent components while maintaining the thin overall structure necessary for ultra-high frequency operation
Solution Approach 2:
The thickening portion acts as a preventive measure by reinforcing the vibration structure before vibration occurs. This pre-reinforcement reduces the deformation amplitude during vibration, thereby preventing the vibration structure from hitting adjacent components before the problem can occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively minimizes deformation of the vibration structure, preventing contact with adjacent components and maintaining thermal stress isolation, with deformation reduced from 28 microns to 1 micron or less when the thickening portion's protrusion height exceeds 4 microns.
Implementation Method 1
A resonator is an electronic component that utilizes the piezoelectric properties of the material and the natural resonance frequency of the material
Implementation Method 2
the thickness of the thickening portion of the vibration region is greater than the thickness of the plate portion. Thus, the deformation amount of the vibration region during vibration is reduced
Data Source
AI summary
A suspended resonator including a vibration structure, a first electrode, and a second electrode is provided. The vibration structure includes a vibration region, a frame portion, and a connecting portion. The vibration region includes a plate portion and a thickening portion. The plate portion has a first surface and a second surface opposite to each other. The thickening portion surrounds a central part of the plate portion, and an edge part of the plate portion is sandwiched in the thickening portion. A thickness of the thickening portion is greater than a thickness of the plate portion. The frame portion surrounds the vibration region and maintains a gap with the vibration region. The connecting portion connects the thickening portion with the frame portion. The first electrode is disposed on the first surface. The second electrode is disposed on the second surface.