Suspended Substrate Package for mm-Wave Array Signal Integrity
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Solution Overview
Problem
Existing mm-wave communication systems employing coplanar waveguides and unshielded transmission structures fail to provide a compact and low-cost solution for wireless devices, as they suffer performance degradation in compact packaging scenarios and result in bulky structures.
Innovation Solution
A modular wireless antenna array system using integrated high-performance package systems with a phased array antenna structure, incorporating a millimeter-wave (mm-wave) communication device that includes a host processor, RAM, and a radio frequency interface, with antennas designed for small form factor packages to enable efficient mm-wave frequency radio signal transmission and reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If coplanar waveguides and unshielded transmission structures are used, then device complexity is reduced, but performance degradation occurs in compact packaging scenarios
Solution Approach 1:
The patent transitions from conventional coplanar waveguide structures to suspended substrate structures with air gaps, fundamentally changing the physical parameters of the transmission medium. This parameter change enables compact packaging while maintaining signal integrity by reducing parasitic effects and improving electromagnetic field confinement.
Solution Approach 2:
The patent employs composite structures combining suspended substrates with air gaps and metallic shields, creating a hybrid transmission structure that leverages the advantages of different materials and configurations to achieve both compactness and high performance in mm-wave applications.
2Ease of manufacture
If conventional transmission structures are used, then manufacturing cost is reduced, but bulky structures result
Solution Approach 1:
The patent utilizes the vertical dimension by suspending substrates above the package cavity, creating air gaps that provide electromagnetic benefits without increasing the horizontal footprint. This dimensional approach enables compact form factors while maintaining transmission performance.
Solution Approach 2:
The suspended substrate structure is nested within the package cavity, with multiple layers and components arranged vertically to maximize space utilization. This nesting approach achieves compact packaging by efficiently utilizing the three-dimensional space available in the device.
3Volume of moving object
If compact packaging is implemented, then device size is reduced, but performance degradation occurs
Solution Approach 1:
By changing the physical configuration to suspended substrates with controlled air gaps, the patent maintains signal transmission performance in compact packages. The air gap parameter is optimized to provide electromagnetic isolation and reduce parasitic effects while minimizing overall device size.
Solution Approach 2:
The patent applies different structural qualities to different regions: suspended substrates with air gaps in critical signal transmission areas, and conventional structures in non-critical areas. This localized optimization maintains performance where needed while achieving compactness overall.
Data Source
AI summary
Embodiments of integrated high performance package systems for millimeter-wave array applications are described herein. Other embodiments may be described and claimed.