Suspended Wick 2-Phase Cooling for Bubble-Free Chip Heat Transfer
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Solution Overview
Problem
Existing cooling systems for semiconductor devices face inefficiencies due to air bubbles adsorbed on heating surfaces and require high maintenance, especially in high-power density applications, limiting their performance and increasing costs.
Innovation Solution
A 2-phase cooling structure with a cooling channel and suspended wick structure that utilizes capillary forces to separate liquid and vapor coolant phases, reducing bubble adhesion and eliminating the need for external pumps, thereby enhancing cooling efficiency and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air bubbles are adsorbed on the heating surface in conventional 2-phase cooling systems, then cooling efficiency decreases due to thermal resistance, but the system structure remains simple
Solution Approach 1:
The patent extracts and removes air bubbles from the heating surface by designing a cooling channel structure that facilitates bubble escape. The channel geometry and flow path are configured to separate vapor bubbles from the liquid coolant, preventing bubble accumulation on the semiconductor chip surface and maintaining effective heat transfer.
Solution Approach 2:
The patent introduces an intermediary mechanism in the form of a structured cooling channel that mediates between the heat-generating semiconductor chip and the coolant. This channel structure facilitates phase change, heat transfer, and bubble removal, acting as an intermediary system that resolves the conflict between maintaining liquid contact for cooling and removing air bubbles that cause thermal resistance.
2Productivity
If pumps and complex nozzle systems are used in immersion, spray, and jet impingement cooling methods, then coolant delivery is improved, but device complexity increases
Solution Approach 1:
The patent implements self-service cooling by eliminating external pumps and complex nozzle systems. The cooling channel structure itself generates the necessary coolant flow through natural convection and phase change mechanisms. The design uses the heat from the semiconductor chip to drive the phase change of the coolant, creating a self-sustaining cooling cycle without requiring additional active components.
Solution Approach 2:
The patent replaces mechanical pumping systems with a passive thermal-driven flow system. Instead of using mechanical pumps to force coolant circulation, the system relies on natural convection currents and phase change (evaporation and condensation) to drive coolant movement through the channels, substituting mechanical complexity with thermal physics-based flow generation.
3Reliability
If high-pressure pumps are used to increase coolant flow rate, then cooling capacity is improved, but energy consumption increases
Solution Approach 1:
The cooling system operates autonomously without external energy input for pumping. The phase change of the coolant (liquid to vapor and back to liquid) naturally drives the circulation through the cooling channels, using the thermal energy from the semiconductor chip itself to power the cooling process, thereby eliminating the need for energy-consuming pumps.
Solution Approach 2:
The patent utilizes phase transitions of the coolant as the driving mechanism for coolant circulation. As the coolant absorbs heat from the semiconductor chip, it evaporates and rises; the vapor then condenses and returns to the cooling channel, creating a natural circulation loop. This phase-change-driven mechanism provides sustained coolant flow and high cooling capacity without requiring external energy input for pumping.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 2-phase cooling system improves heat exchange by separating bubbles from the heating surface, reducing hot spots, and minimizing power consumption while maintaining high cooling performance without the need for external coolant supply devices.
Implementation Method 1
a wick structure configured to generate a capillary force for moving the coolant in the liquid phase along a wall surface of the cooling channel
Implementation Method 2
a cooling channel configured to allow a coolant to (i) flow in liquid phase and (ii) absorb heat generated by the semiconductor chip during operation
Implementation Method 3
a 2-phase cooling type involving phase changes of a coolant. 2-phase cooling methods may be used to process heat in a wider range than single-phase cooling methods
Data Source
Figure 1
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Figure 3A
AI summary
A semiconductor device includes: a semiconductor chip; a cooling channel configured to allow a coolant to (i) flow in liquid phase and (ii) absorb heat generated by the semiconductor chip during operation; and a wick structure configured to generate a capillary force for moving the coolant in the liquid phase along a wall surface of the cooling channel. The wick structure includes a suspended wick structure that is disposed apart from the wall surface by a capillary distance.