Swaged Lead Frame Structure for Semiconductor Heat Spreading
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently dissipating heat due to limitations in the design of conductive members, which restrict the spread of heat from the semiconductor element to the heat sink, affecting overall thermal management and mounting strength.
Innovation Solution
The semiconductor device incorporates a conductive member with a die pad portion and terminal portions that are swaged together to form a single-piece first lead, allowing for enhanced heat dissipation and increased mounting strength, while the sealing resin provides a creepage distance to prevent electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional lead frame structure with separate bonding steps is used, then the manufacturing process is well-established, but the heat dissipation efficiency is limited and the structure requires multiple bonding materials
Solution Approach 1:
The patent merges the die pad and terminal portions into a single integrated conductive member formed from one piece of rectangular bar stock. This eliminates the need for separate bonding steps and multiple bonding materials between the die pad and terminal portions, while simultaneously improving heat dissipation by creating a continuous thermal path throughout the entire conductive member structure.
2Temperature
If the conductive member uses a single-piece rectangular bar stock design, then heat can spread over a wider area improving thermal management, but the manufacturing precision requirements increase
Solution Approach 1:
The patent specifies precise dimensional parameters for the rectangular bar stock, including width W1 and thickness T1 for the die pad portion, and length L1 and width W2 for the terminal portions. By carefully controlling these dimensional parameters within specified ranges, the design achieves optimal heat dissipation while maintaining manufacturability and assembly compatibility.
3Strength
If additional bonding materials are used to attach terminal portions to die pad, then the assembly flexibility increases, but the mounting strength decreases and the process becomes more complex
Solution Approach 1:
The conductive member is formed as a single integral piece from rectangular bar stock, eliminating the need for separate bonding materials to attach terminal portions to the die pad. This monolithic structure provides superior mounting strength through continuous metal construction while simplifying the manufacturing process by removing bonding steps and material selection requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency by allowing heat to spread over a wider area before reaching the heat sink, enhancing thermal management and achieving higher mounting strength without the need for additional bonding materials.
Implementation Method 1
terminal portions (112, 122, 132, 142) that are swaged to a first section (1121) of the first lead (11)
Data Source
AI summary
A semiconductor device includes a semiconductor element, a first lead including a die pad portion and a first terminal portion, and a sealing resin. A first-lead reverse surface is exposed from a second resin surface. The first terminal portion includes a first section joined to the die pad portion, a second section located on a first side in a z direction with respect to the first section and used for mounting, and a third section between the first section and the second section.