SWCNT Contacts in Field Effect Transistors Below 10 Nm

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Solution Overview

Problem

The miniaturization of transistors faces challenges due to increased contact resistance and deteriorated conductivity when reducing contact length below 10 nm, particularly in two-dimensional field effect transistors, as traditional metals exhibit crystal domaining and two-dimensional semimetals like graphene suffer from quantization and edge scattering.

Innovation Solution

A field effect transistor design utilizing single-walled carbon nanotubes (SWCNTs) with the same chirality on a two-dimensional semiconductor, achieving an ultra-short contact length of 2 nm, allowing switching between Schottky and ohmic contacts through gate voltage adjustment, and utilizing a method to measure interface resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the contact length is reduced to less than 10 nm to miniaturize the transistor, then the device size is reduced, but the contact resistance increases and conductivity deteriorates

Engineering Contradiction:
Improvecontact lengthVSAvoidcontact resistance
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The patent changes the material parameter from traditional three-dimensional metals to two-dimensional semimetals (graphene, semimetallic nanotubes), which fundamentally alters the electrical transport properties and enables low contact resistance at ultra-short lengths below 10 nm

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite contact structures combining two-dimensional semimetal materials with conventional metals, creating a hybrid system that leverages the low contact resistance of 2D materials while maintaining the electrical conductivity and mechanical properties of traditional metals

Inventive Principle:
Principle #40Composite materials

2Reliability

If traditional three-dimensional metal is used for contact, then the conductivity is maintained, but crystal domaining phenomenon occurs and resistivity increases when contact length is less than 10 nm

Engineering Contradiction:
ImproveconductivityVSAvoidcrystal domaining phenomenon
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the crystalline metallic contact material with a two-dimensional semimetallic material, substituting the mechanical crystal structure with a two-atom-thick semiconductor lattice that eliminates crystal domaining effects at ultra-short dimensions

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Length of moving object

If two-dimensional semimetal such as graphene is used for contact, then the contact length can be reduced, but additional quantization and severe edge scattering occur

Engineering Contradiction:
Improvecontact lengthVSAvoidcontact resistance
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The patent applies local quality by using different two-dimensional semimetal materials with different band structures in different regions - metallic nanotubes for ohmic contact regions and semiconducting nanotubes or graphene for regions requiring Schottky contact, optimizing performance at each location

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves low resistivity and contact resistance of 10−6 Ω·cm² and 50 kΩ·μm, respectively, with the SWCNTs providing improved conductivity and reduced contact resistance.

Implementation Method 1

a gate electrode 102, an insulating layer 104, a channel layer 106... The channel layer 106 is located on the surface of the insulating layer 104 away from the gate electrode 102

Methodology Applied
Scientific EffectField effect: Electric Field

Data Source

PatentUS12532496B2Field effect transistor and method for making the same
Publication Date: 2026.01.20 HON HAI PRECISION INDUSTRY CO LTD
  • US12532496B2 patent drawing
  • US12532496B2 patent drawing
  • US12532496B2 patent drawing

AI summary

A field effect transistor includes a gate electrode, an insulating layer, a source electrode, a drain electrode, and a channel layer. The insulating layer is located on the surface of the gate electrode, and the channel layer is located on the surface of the insulating layer away from the gate electrode. The source electrode and the drain electrode are spaced apart from each on the surface of the channel layer away from the insulating layer. The source electrode and the drain electrode are one-dimensional structures. The present application further provides a method for making the field effect transistor.