SWCNT Film Laminate Bonding Without Solvent Bubble Defects
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Solution Overview
Problem
Existing methods for manufacturing electrically conductive film laminates using single-wall carbon nanotubes (SWCNTs) face issues with adhesion stability and bubble formation due to solvent volatilization in the binder layer, leading to inconsistent film quality.
Innovation Solution
A method involving a substrate with an adhesive layer and an SWCNT film, where the adhesive layer includes a hardened product of an acrylic-based adhesive and metal ions, achieved through thermocompression bonding and etching, ensuring strong adhesion and improved conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a binder layer with solvent component (alcohol or ester) is used for adhesion, then adhesion between layers is improved, but solvent volatilization during hardening causes bubble generation and adhesion decrease
Solution Approach 1:
The patent changes the chemical composition parameters of the binder layer by incorporating metal ions (such as aluminum, calcium, or zinc ions) into the binder formulation. This modification allows the binder to achieve adequate adhesion without relying on volatile organic solvents, thereby eliminating bubble generation while maintaining bonding strength between the graphene sheet and substrate.
Solution Approach 2:
The patent replaces traditional solvent-based binders with a solvent-free or low-solvent binder system containing metal ions. This substitution eliminates the need for volatile components that cause bubbles, while the metal ions provide durable adhesion properties that persist through the hardening process without degradation from solvent volatilization.
2Ease of manufacture
If traditional binder layer manufacturing method is used, then manufacturing process is simple, but film quality is unstable due to adhesion issues and bubble formation
Solution Approach 1:
The patent modifies the binder layer composition by adding metal ions to create a more stable chemical system. This parameter change ensures consistent adhesion properties and prevents bubble formation during hardening, thereby improving film quality consistency while maintaining the overall simplicity of the manufacturing process.
Solution Approach 2:
The patent creates a composite binder layer system that combines traditional binder materials with metal ion additives. This composite formulation provides both the adhesion properties needed for reliable bonding and the structural stability required to prevent bubble formation, resulting in consistent high-quality films across production batches.
3Adaptability or versatility
If solvent component is included in binder layer for flexibility, then binder layer flexibility is improved, but adhesion stability deteriorates due to solvent volatilization
Solution Approach 1:
The patent changes the binder layer composition by incorporating metal ions that provide both flexibility and adhesion stability. The metal ions form stable chemical bonds that maintain adhesion strength while allowing the binder matrix to retain its flexible properties, eliminating the trade-off between flexibility and adhesion stability that exists in solvent-based systems.
Solution Approach 2:
The patent eliminates volatile solvent components from the binder layer formulation, replacing them with non-volatile metal ion additives. This substitution removes the source of adhesion instability caused by solvent volatilization, while the metal ions continue to provide the necessary flexibility and bonding characteristics for the binder layer to function effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a stable electrically conductive film laminate with enhanced conductivity and prevents bubble formation, maintaining film quality and adhesion between layers.
Implementation Method 1
an adhesive layer formed on a surface of the substrate to be laminated
Implementation Method 2
performing heating and pressure bonding
Implementation Method 3
performing heating and pressure bonding
Implementation Method 4
an etching step for manufacturing the electrically conductive film laminate by etching the forming substrate of the second laminate
Data Source
AI summary
Provided is a method of manufacturing an electrically conductive film laminate 1 including a substrate to be laminated 10, an adhesive layer 20 formed on a surface of the substrate to be laminated 10, and an electrically conductive carbon film 30 formed on a surface of the adhesive layer 20, the method including: a first laminate manufacturing step for manufacturing a first laminate 110 including a forming substrate 40 for forming the electrically conductive carbon film 30 on a surface thereof, the electrically conductive carbon film 30 formed on a surface of the forming substrate 40, and the adhesive layer 20 formed on a surface of the electrically conductive carbon film 30; a thermocompression bonding step for manufacturing a second laminate 120 by bringing the adhesive layer 20 of the first laminate 110 into contact with the substrate to be laminated 10, and then performing heating and pressure bonding; and an etching step for manufacturing the electrically conductive film laminate 1 by etching the forming substrate 40 of the second laminate 120.