Swing Nozzle Electromagnetic Damping for Substrate Cleaning
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Solution Overview
Problem
In single wafer type cleaning devices for semiconductor and display manufacturing, nozzle vibration leads to inefficient cleaning processes, causing contaminants to be sprayed beyond intended areas and potentially damaging substrate patterns.
Innovation Solution
A substrate processing apparatus with a swing nozzle and an acceleration sensor that uses an electromagnet and magnet connected through springs to generate damping forces, adjusting the distance between them based on sensed acceleration to minimize vibration, thereby optimizing the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a swing nozzle is used to spray chemical solution on the substrate, then cleaning coverage and efficiency are improved, but nozzle vibration occurs causing pattern collapse
Solution Approach 1:
An acceleration sensor detects the vibration of the swing nozzle in real-time, and the controller adjusts the damping force by controlling the electromagnet based on the sensor output signal, creating a closed-loop feedback system that actively compensates for vibrations
Solution Approach 2:
A damper comprising an electromagnet and a magnet is introduced as an intermediary component between the swing nozzle and its support structure. The electromagnetic interaction between these magnets provides controllable damping force to suppress nozzle vibration without directly modifying the nozzle itself
2Manufacturing precision
If damping force is increased to reduce nozzle vibration, then pattern collapse is prevented, but the complexity of the apparatus increases
Solution Approach 1:
The damper assembly serves multiple functions: it provides vibration damping through electromagnetic interaction, allows adjustable damping force through controllable current, and integrates with the existing swing nozzle mechanism. The single damper structure handles both vibration suppression and positioning control
Solution Approach 2:
The patent replaces passive mechanical damping mechanisms with an active electromagnetic damping system. The electromagnet and magnet interaction provides controllable damping force that can be adjusted electronically, eliminating the need for complex mechanical shock absorbers or springs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces nozzle vibration during both constant speed and stopping phases, ensuring consistent and controlled chemical solution application to the substrate, minimizing pattern damage and improving yield.
Implementation Method 1
a damper that is arranged on the other side of the swing nozzle, and performs a damping operation according to an acceleration sensed by the acceleration sensor, wherein the damper comprises an electromagnet connected to the other side of the swing nozzle through a first spring and a magnet connected to the other side of the swing nozzle through a second spring and arranged to face the electromagnet
Data Source
AI summary
Provided is a substrate processing apparatus. The substrate processing apparatus includes a swing nozzle that is arranged on one side of the support module, moves in a swing manner, and sprays a chemical solution to the substrate, a sensor arranged on one side of the swing nozzle to sense movement of the swing nozzle, an electromagnet and a magnet installed on the other side of the swing nozzle so as to be able to adjust spacing relative to each other, and a controller for receiving a sensing result of the sensor and performing a damping operation to the swing nozzle by providing power to the electromagnet to generate an attractive force or repulsive force between the electromagnet and the magnet.