Swing Shield Structure for Clean Thin-Film Deposition Carriers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
During the cleaning process of thin-film-deposition equipment, pollutant particles can inadvertently pollute the substrate carrier, requiring a solution to prevent contamination.
Innovation Solution
A shielding device with two shield members that can rotate and swing in opposite angular directions to switch between a shielding state and an open state, covering the substrate carrier to prevent pollutant particles from reaching it during cleaning, and forming a whole shield for improved space efficiency and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the substrate carrier is kept out during cleaning process, then the substrate carrier is protected from pollutant contamination, but the device complexity increases and space efficiency decreases
Solution Approach 1:
The shielding device is divided into two separate shield members (first shield member and second shield member) that can independently swing in opposite angular directions. Each shield member can be positioned independently to provide protection during cleaning operations, reducing the complexity compared to a single large movable shield while maintaining effective contamination prevention.
Solution Approach 2:
The shield members are designed to be dynamically movable rather than stationary, allowing them to swing between a shielding state (covering the substrate carrier) and an open state (allowing access). This dynamic capability enables the system to adapt to different operational modes without requiring multiple separate components.
2Object-affected harmful factors
If a single large shield is used to cover the substrate carrier, then space efficiency is reduced, but the shielding effectiveness is improved
Solution Approach 1:
The shield is segmented into two smaller shield members that swing in opposite directions. When in the shielding state, they collectively cover the substrate carrier effectively. When opened, they occupy less space within the reaction chamber compared to a single large shield, improving space efficiency while maintaining shielding effectiveness when needed.
Solution Approach 2:
The two shield members are interconnected by a driver mechanism that coordinates their movement. When both shield members are positioned to cover the substrate carrier, they merge to form a complete shielding barrier, achieving the same protective effect as a single large shield while allowing individual movement for space optimization.
3Reliability
If the shield members are made thick for durability, then the device complexity and space requirements increase, but the reliability against high temperature and deformation is improved
Solution Approach 1:
The shield members are constructed using composite material structures that provide high temperature resistance and mechanical strength without requiring excessive thickness. This allows the shield members to maintain durability against high temperature and deformation while occupying less space and reducing overall device complexity compared to solid thick shields.
Data Source
AI summary
The present disclosure provides a thin-film-deposition equipment with shielding device, which includes a reaction chamber, a carrier and a shielding device, wherein a portion of the shielding device and the carrier are disposed within the reaction chamber. The shielding device includes a first-shield member, a second-shield member and a driver. The driver interconnects the first-shield member and the second-shield member, for driving the first-shield member and the second-shield member to move in opposite directions. During a deposition process, the driver swings the shield members away from each other into an open state. During a cleaning process, the driver swings the shield members toward each other into a shielding state for covering the carrier, such that to prevent polluting the carrier during the process of cleaning the thin-film-deposition equipment.


