Swingable Laser Heating Unit for Substrate CD Uniformity
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Solution Overview
Problem
In semiconductor manufacturing, precise control of critical dimensions (CDs) of patterns on a substrate is challenging due to deviations between monitoring and anchor patterns, requiring extensive etching processes and time, and accurate laser irradiation is hindered by installation tolerances in optical modules.
Innovation Solution
An apparatus and method featuring a heating unit with a laser that swingably moves on a coordinate system, allowing precise calculation of its swing arm length to ensure accurate laser positioning and uniformization of pattern CDs, using a support unit, liquid supply, and image module for real-time monitoring and correction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If extensive etching processes are performed to equalize critical dimensions of monitoring and anchor patterns, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The patent introduces a deviation correction process that performs preliminary measurements and calculations of critical dimension deviations between monitoring and anchor patterns before the main etching process. By pre-determining the required correction amounts and applying targeted etching, the process avoids extensive iterative etching, thereby reducing total process time while maintaining precision.
Solution Approach 2:
The patent changes the etching parameters dynamically based on measured deviations. Instead of using uniform etching conditions, the system adjusts etching depth, duration, and intensity according to the specific deviation values detected in different pattern regions, enabling precise correction with minimized etching time.
2Ease of manufacture
If installation tolerances in optical modules are present, then ease of manufacture is improved, but measurement precision of laser positioning deteriorates
Solution Approach 1:
The patent employs a feedback mechanism where the actual position of the laser irradiation point is continuously monitored and compared with the target position. The system uses this feedback information to calculate and apply real-time corrections for deviations caused by optical module installation tolerances, thereby maintaining high positioning precision despite manufacturing variations.
Solution Approach 2:
The patent replaces reliance on purely mechanical precision (optical module installation accuracy) with an optical measurement and computational correction system. By using optical fields for measurement and mathematical calculations for position correction, the system achieves high precision without requiring extremely tight mechanical tolerances.
3Manufacturing precision
If critical dimension correction process is added to equalize monitoring and anchor patterns, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by focusing correction efforts only on specific regions where deviations are detected, rather than uniformly treating the entire substrate. The system identifies monitoring and anchor pattern locations, measures deviations locally, and applies targeted correction only to affected areas, thereby reducing overall process complexity while maintaining precision.
Solution Approach 2:
The patent segments the correction process into distinct measurable steps: deviation detection, calculation, and targeted correction. By dividing the complex correction task into these manageable segments, the system reduces overall complexity and makes each step more controllable and easier to implement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient substrate treatment, uniform CD formation, and accurate laser positioning, reducing the time and complexity of CD correction processes while enhancing the precision of semiconductor manufacturing.
Implementation Method 1
a heating unit heating a specific location of the substrate by irradiating a laser to the specific location on the substrate
Data Source
AI summary
Provided is an apparatus for treating a substrate, which includes: a support unit supporting a substrate; a liquid supply unit supplying a treatment liquid to the substrate supported on the support unit; a heating unit heating a specific location of the substrate by irradiating a laser to the specific location on the substrate supported on the support unit, and swingably moved between the specific location of the substrate, and a waiting location of deviating from the substrate; a coordinate unit disposed below an irradiation end portion to which the laser is irradiated from the heating unit when the heating unit is positioned at the waiting location; and an image module monitoring the laser irradiated from the heating unit, in which the image module calculates a movement distance in which the heating unit is swingably moved on the coordinate unit to measure a first length in a longitudinal direction of the heating unit.