Switch Assembly for Reactive Power Compensation with Stacked Cooling Plates

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Solution Overview

Problem

Existing switch assemblies for reactive power compensation apparatuses face challenges in optimal arrangement, alignment, and heat dissipation due to the heavy and bulky nature of thyristors, which complicates handling and installation.

Innovation Solution

A switch assembly with a support module and stacked switching modules, featuring cooling plates with engagement protrusions for alignment and heat dissipation, and modular design for easy installation, allowing for efficient stacking and cooling of thyristors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If thyristors are connected in series to control high voltage or high current, then the reactive power compensation capability is improved, but the weight and bulkiness of the switch assembly increases

Engineering Contradiction:
Improvereactive power compensation capabilityVSAvoidweight of thyristor assembly
Core Design Contradiction:
PowerVSWeight of moving object

Solution Approach 1:

The switch assembly is divided into multiple switching modules, each containing a limited number of thyristors connected in series. This segmentation allows the heavy thyristor assembly to be broken into manageable units that can be independently handled and installed, while still achieving the required high voltage blocking capability when modules are connected in series/parallel configurations.

Inventive Principle:
Principle #1Segmentation

2Power

If multiple thyristors are connected in series to achieve high voltage control, then the voltage control capability is improved, but the alignment difficulty increases due to heavy weight

Engineering Contradiction:
Improvevoltage control capabilityVSAvoidalignment ease
Core Design Contradiction:
PowerVSEase of operation

Solution Approach 1:

The patent transitions from horizontal/planar arrangement of thyristors to vertical stacking configuration. By arranging switching modules in the vertical dimension with engagement portions that guide alignment, the system achieves high voltage control capability while simplifying the alignment process through gravitational assistance and mechanical guidance features.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Engagement portions are introduced as intermediary mechanical features between switching modules. These engagement portions include alignment guides and positioning structures that facilitate precise alignment of heavy thyristor modules during assembly, eliminating the need for complex alignment procedures.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Power

If thyristors are arranged to handle high current, then the current control capability is improved, but the heat dissipation challenge increases

Engineering Contradiction:
Improvecurrent control capabilityVSAvoidheat dissipation difficulty
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The cooling plate is merged with the switching module structure, forming an integrated thermal management system. The cooling plate is positioned in direct thermal contact with the thyristors, creating a unified assembly where heat dissipation is built into the module itself rather than being a separate subsystem.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

A liquid cooling system is implemented using cooling water flowing through channels in the cooling plate. This hydraulic cooling approach efficiently removes heat from the thyristors during high-current operation, maintaining operational temperature within acceptable limits.

Inventive Principle:
Principle #29Pneumatics and hydraulics

4Area of stationary object

If a compact arrangement of thyristors is implemented, then the occupied area is reduced, but the installation complexity increases

Engineering Contradiction:
Improveoccupied areaVSAvoidinstallation complexity
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The compact switch assembly is segmented into standardized switching modules that can be manufactured independently and then assembled. This modular segmentation maintains compact footprint while simplifying installation, as modules can be pre-assembled and tested before final installation in the reactive power compensation apparatus.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes vertical stacking of switching modules to achieve compact horizontal footprint. By arranging modules in the vertical dimension rather than spreading them out horizontally, the assembly occupies minimal floor space while maintaining ease of installation through standardized vertical stacking interfaces.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution optimizes the arrangement and alignment of switches, minimizes occupied area, facilitates heat dissipation, and simplifies installation, enhancing the overall performance and efficiency of reactive power compensation systems.

Implementation Method 1

a plurality of cooling plates stacked along a vertical direction with respect to the supporting module; and a plurality of switches disposed between the plurality of cooling plates

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10560091B2Switch assembly of reactive power compensation apparatus
Publication Date: 2020.02.11 LSIS CO LTD
  • US10560091B2 patent drawing
  • US10560091B2 patent drawing
  • US10560091B2 patent drawing

AI summary

A switch assembly of a reactive power compensation apparatus may include a first switching module having a first stack structure perpendicular to a supporting module, and a second switching module having a second stack structure perpendicular to the supporting module, the second switching module being connected in parallel with the first switching module. Each of the first and second switching modules may include a plurality of cooling plates stacked along a vertical direction with respect to the supporting module, and a plurality of switches disposed between the plurality of cooling plates. The cooling plate may include an engagement portion disposed on one side of the upper surface to be located at a normal position by guiding the switch.