Soldered Block Prevents Switch Base Deformation
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Solution Overview
Problem
Small plastic components, such as electrical switches, are prone to permanent deformation under actuation force due to their thin material thickness, which renders them unusable or alters their operating characteristics, and existing designs that incorporate a foot to prevent deformation increase the component's height and are not suitable for surface mounting by reflow soldering.
Innovation Solution
A block is interposed vertically between the substrate and the base of the component, aligned with the actuation force axis, using solder paste to prevent deformation and facilitate surface mounting by forming a spacer between the base and the printed circuit board, allowing the actuation force to be transmitted directly to the board without deforming the base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a foot is molded into the base to prevent deformation under actuation force, then the base deformation is reduced, but the total height of the component increases and it becomes unsuitable for surface mounting by reflow soldering
Solution Approach 1:
The invention transitions from a vertical support structure (foot extending downward) to a horizontal surface mounting approach. The block is placed on the upper face of the printed circuit board, changing the dimension in which the support function is realized. This allows the base to be supported without increasing its height, enabling surface mounting while preventing deformation.
Solution Approach 2:
The block acts as an intermediary element between the base and the printed circuit board. Instead of the base directly contacting the board or extending downward for support, the block mediates this interaction by providing a support surface on the board's upper face, thus preventing base deformation without increasing component height.
2Volume of moving object
If the component is made very small to reduce size, then the component dimensions are reduced, but the plastic thickness becomes very thin making the component prone to permanent deformation
Solution Approach 1:
The invention applies local reinforcement by placing a block specifically at the critical location where the base contacts the printed circuit board. This localized support provides the necessary strength to prevent deformation of the thin plastic base without requiring the entire component to be larger or thicker.
Solution Approach 2:
The block serves as a mediator that distributes and transfers the actuation force from the base to the printed circuit board, preventing the thin plastic base from bearing the full force and deforming. This allows small component dimensions while maintaining deformation resistance.
3Stability of the object's composition
If a foot extends vertically to the upper face of the printed circuit board to prevent deformation, then base deformation is avoided, but the component cannot be surface mounted by reflow soldering due to variable rising during soldering
Solution Approach 1:
The invention changes the dimensional approach from vertical extension (foot to lower face) to horizontal placement (block on upper face). This dimensional shift allows the base to be stable during actuation while having a flat lower face suitable for surface mounting and reflow soldering processes.
Solution Approach 2:
The support function is segmented from the base structure itself. Instead of the base having an integrated foot that causes mounting issues, the support function is provided by a separate block element placed on the board, allowing the base to be optimized for surface mounting while the block provides the necessary structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents deformation of the base during actuation and enables reliable surface mounting by reflow soldering, maintaining the component's integrity and operational characteristics while allowing for a more compact design.
Implementation Method 1
The block may include a spot of solder paste designed to be soldered to a conducting pad associated with the upper face of the substrate
Data Source
AI summary
An arrangement may include a substrate and an electrical component. The electrical component may include a base made of an insulating material and a plurality of connection terminals. Each connection terminal is connected to a corresponding connection pad of the substrate by means of a spot of solder paste. The arrangement may further include a block interposed between the substrate and the base of the electrical component. The block may be located substantially on the axis of application of a force for actuating the electrical component and may be designed to inhibit deformation of the base. The block may include a spot of solder paste soldered to an associated conducting pad on the substrate.