Thermally Responsive Switch Cover Plate Heat Conduction

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Solution Overview

Problem

Conventional thermally responsive switches in sealed motor compressors have reduced heat conductivity due to extensive coverage of the outer surface of the cover plate with electrically insulative resin, which hinders effective temperature adjustment and release, and struggles to maintain the required insulation distance between the cover plate and conductive terminal pins.

Innovation Solution

A thermally responsive switch design featuring through holes with cylindrical portions on the cover plate, where only the end portions, the filler, and conductive terminal pins are covered with electrically conductive resin, enhancing heat conductivity by maintaining the thickness of the cover plate and increasing the surface area for heat conduction, while ensuring sufficient insulation distance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the outer surface of the cover plate is covered with electrically insulative resin to maintain insulation distance, then electrical insulation is improved, but heat conductivity deteriorates

Engineering Contradiction:
Improveelectrical insulationVSAvoidheat conductivity
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent applies electrically insulative resin only to specific local areas where insulation is required (between terminal pins and cover plate, and on terminal pin surfaces) rather than covering the entire outer surface of the cover plate. This localized application maintains necessary electrical insulation while preserving heat conductivity in the majority of the cover plate surface area.

Inventive Principle:
Principle #3Local quality

2Temperature

If the thickness of the cover plate is reduced to improve heat conductivity, then heat conductivity is improved, but structural strength deteriorates

Engineering Contradiction:
Improveheat conductivityVSAvoidstructural strength
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent optimizes the thickness parameter of the cover plate to achieve a balance between heat conductivity and structural strength. By carefully selecting and controlling the thickness parameter within specific ranges, the design improves heat conduction capability while maintaining sufficient mechanical strength for structural integrity.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the insulation distance between cover plate and conductive terminal pins is increased to 2 mm, then electrical insulation is improved, but device complexity increases

Engineering Contradiction:
Improveelectrical insulationVSAvoidinsulation distance requirement
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces electrically insulative resin as an intermediary material between the conductive terminal pins and the cover plate. This resin layer provides the necessary electrical insulation, allowing the design to meet the 2 mm insulation distance requirement while managing the complexity through material selection rather than increased spatial separation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly improves the heat conductivity of the sealed container, maintains the strength of the conductive terminal pin mounting area, and ensures reliable insulation, effectively managing temperature adjustments and releases in thermally responsive switches.

Implementation Method 1

the thermally responsive plate, being curved, is configured to invert its direction of curvature at a predetermined temperature

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

The resin 121 significantly reduces the heat conductivity of the sealed container 102

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

improving heat conductivity of the sealed container, serving as the main body of the thermally responsive switch

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS9972470B2Thermally responsive switch and method of manufacturing same
Publication Date: 2018.05.15 UBUKATA IND CO LTD
  • US9972470B2 patent drawing
  • US9972470B2 patent drawing
  • US9972470B2 patent drawing

AI summary

A thermally responsive switch is provided with a sealed container having a housing and a cover plate secured to the housing; a couple of conductive thermal pins inserted into a couple of through holes provided on the cover plate and secured by an insulative filler; a stationary contact secured to one of the conductive thermal pins inside the container; a heater having one end connected to the other of the conductive terminal pins inside the container and the other end connected to the cover plate; a thermally responsive plate having one end connected to the housing and being configured to invert a direction of curvature thereof at a predetermined temperature; and a movable contact provided on the other end of the thermally responsive plate. The through holes are configured by cylindrical portions, only the cylindrical portions, the filler, and the conductive terminal pins being covered by an insulative resin.