Switch Device With Offset Locating Pins For Port Density
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Solution Overview
Problem
The increasing number of ports in switch devices within a limited 1U rack space leads to reduced space per port, making manufacturing complex and requiring more dexterity and force for assembly, while also limiting the number of push-fit pin connectors due to substrate thickness constraints.
Innovation Solution
A switch device with a planar substrate featuring offsetting locating pins on opposing faces, allowing for increased port density, and the use of flexible or spring gaskets to minimize electromagnetic leakage and accommodate manufacturing tolerances, along with indicators for active ports.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of ports is increased in a 1U rack space, then port density is improved, but the space available per port decreases making manufacturing more complex and assembly more difficult
Solution Approach 1:
The patent utilizes both faces of the substrate to mount ports, effectively adding a dimensional aspect to port arrangement. Instead of concentrating all ports on one face, ports are distributed across the first and second opposing faces, doubling the available mounting area and reducing the density requirement per face.
Solution Approach 2:
The port arrangements on the two faces are segmented into separate groups that can be independently designed and manufactured. Each face can have its own optimized port layout and connector type, allowing for modular manufacturing approaches that simplify the overall manufacturing process while achieving high total port counts.
2Quantity of substance
If the number of ports is increased in a 1U rack space, then port density is improved, but the space available per port decreases requiring more dexterity and force for assembly
Solution Approach 1:
By distributing ports across two opposing faces of the substrate, the available working space for assembly operations is effectively doubled. This dimensional distribution provides adequate clearance around each port for insertion tools and operator dexterity, even when the total port count is high.
3Length of stationary object
If the substrate thickness is limited by 1U rack constraints, then the chassis height is controlled, but the number of push-fit pin connectors is limited due to substrate thickness constraints
Solution Approach 1:
The patent transitions from a single-face port arrangement to a dual-face arrangement, effectively utilizing the third dimension (depth/thickness direction) by wrapping around to the opposing face. This allows push-fit pin connectors to be distributed across two faces, doubling the connector capacity within the same substrate thickness constraint.
Solution Approach 2:
The locating pin arrangements on opposing faces are intentionally offset from each other, creating an asymmetric configuration that optimizes space utilization. This asymmetric offsetting allows for more efficient packing of connectors and locating features across the substrate thickness, maximizing the number of connectors that can be accommodated within the 1U height constraint.
4Quantity of substance
If ports are arranged in dense groups, then port count is increased, but adequate tolerance in the frame around each port array becomes more problematic
Solution Approach 1:
By distributing port arrays across two opposing faces rather than concentrating them on one face, the frame structure can provide adequate tolerance and clearance around each port array. The frame can be designed with separate, optimized enclosures for each face, allowing manufacturing tolerances to be managed independently for each port group.
Data Source
AI summary
A switch device for use in telecommunications apparatus, the switch device comprising: a substantially planar substrate having first substantially planar face and an opposing second substantially planar face; a first plurality of ports mounted on the first face of the substrate, and having a first arrangement of locating pins which extend into the substrate from the first face towards the second face thereof; and a second plurality of ports mounted on the second face of the substrate, and having a second arrangement of locating pins which extend into the substrate from the second face towards the first face thereof, wherein the first arrangement of locating pins is offset with respect to the second arrangement of locating pins.