Switch Device Insulating Overlay Films Prevent Wear

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Solution Overview

Problem

Existing switch devices face issues with improper operation due to dust and wear, which can cause electrical connection between the reversing leaf spring and the lead-out pattern, leading to reduced lifespan and reliability.

Innovation Solution

The implementation of an insulating substrate with a broken annular first fixed contact, a second insulated fixed contact, a lead-out pattern, and overlay films to prevent direct contact between the movable reversing leaf spring and the lead-out pattern, enhancing insulation and wear resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the reversing leaf spring is positioned close to the lead-out pattern to save space, then the device size is reduced, but dust or wear may cause electrical connection between them leading to improper operation

Engineering Contradiction:
Improvedevice sizeVSAvoidoperational reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

An insulating film is introduced as an intermediary layer between the movable reversing leaf spring and the stationary lead-out pattern. This insulating film prevents direct contact and electrical connection between the two conductive elements, eliminating the reliability issue while allowing the components to be positioned close together for compact device size.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

A thin insulating film is applied to cover the lead-out pattern, providing electrical insulation between the movable reversing leaf spring and the stationary lead-out pattern. This thin film structure maintains compact dimensions while ensuring reliable insulation against dust-induced or wear-induced electrical connections.

Inventive Principle:
Principle #30Flexible shells and thin films

2Adaptability or versatility

If the insulating substrate is made flexible to improve adaptability, then the device can be mounted on various surfaces, but the protuberances wear down faster reducing insulation effectiveness

Engineering Contradiction:
Improvemounting adaptabilityVSAvoidinsulation durability
Core Design Contradiction:
Adaptability or versatilityVSDuration of action of stationary object

Solution Approach 1:

The solution combines the flexible insulating substrate with an additional insulating film coating on the lead-out pattern. This composite structure leverages the flexibility of the substrate for mounting adaptability while the added insulating film provides enhanced durability and wear resistance for long-term insulation effectiveness.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If no insulating film is applied to the lead-out pattern to simplify manufacturing, then the manufacturing process is easier, but dust or wear causes electrical connection leading to improper operation

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidelectrical insulation reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

An insulating film is applied to the lead-out pattern to serve as a protective intermediary layer. This film prevents direct contact between dust, wear particles, and the conductive elements, ensuring reliable electrical insulation while maintaining a relatively simple manufacturing process through standard coating techniques.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS7161102B2Switch device
Publication Date: 2007.01.09 ALPS ALPINE CO LTD
  • US7161102B2 patent drawing
  • US7161102B2 patent drawing
  • US7161102B2 patent drawing

AI summary

A switch device including a first fixed contact, a second fixed contact, a lead-out pattern extending from the second fixed contact to the outside of the first fixed contact, and a movable contact disposed on the first fixed contact and formed of a reversing leaf spring is provided. The first fixed contact includes a pair of cutout ends opposing each other across an exposed insulating portion of an insulating substrate. A pair of first overlay films having a predetermined thickness are respectively provided on the cutout ends. A second overlay film is provided on the first overlay films and on the insulating portion disposed on the lead-out pattern.