Solid-State Switch Heat Extraction Through Phase Conductors
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Solution Overview
Problem
Solid state switching devices for low voltage applications face challenges in managing heat dissipation efficiently, leading to size and cost issues due to the need for large heat sink elements, which complicates installation and increases production costs.
Innovation Solution
A solid state switching device with a heat sink element in thermal coupling and an additional heat extraction arrangement that conveys heat along the phase conductor through line terminals, enhancing heat extraction efficiency and allowing for a smaller device size while maintaining effective temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If large heat sink elements are used to ensure sufficient heat dissipation, then heat dissipation efficiency is improved, but device size increases
Solution Approach 1:
The patent combines the heat sink element with the housing structure, merging two previously separate components into one integrated unit. The housing serves dual functions as both structural enclosure and heat dissipation component, eliminating the need for a separate large heat sink while maintaining effective heat dissipation through the housing walls and surfaces.
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: it provides mechanical protection for internal components, structural support for the device, and acts as a heat sink for thermal management. This multi-functionality reduces overall device complexity and size while maintaining heat dissipation efficiency.
2Loss of energy
If large heat sink elements are used to ensure sufficient heat dissipation, then heat dissipation efficiency is improved, but manufacturing cost increases
Solution Approach 1:
By integrating the heat sink functionality into the housing structure, the patent eliminates the need for separate heat sink components and their associated manufacturing processes. This reduces part count, simplifies assembly operations, and lowers overall manufacturing costs while maintaining adequate heat dissipation performance.
Solution Approach 2:
The housing serves multiple purposes including structural enclosure, mechanical protection, and thermal management. This multi-functionality reduces the total number of components required, simplifies the bill of materials, and reduces assembly complexity, thereby lowering manufacturing costs.
3Loss of energy
If large heat sink elements are used to ensure sufficient heat dissipation, then heat dissipation efficiency is improved, but installation difficulty increases
Solution Approach 1:
The integration of heat sink functionality into the housing creates a compact, self-contained unit that requires less installation space and simplifies mounting procedures. The combined structure eliminates the need for separate heat sink installation steps, reducing installation time and complexity.
4Power
If solid state power switches are used to switch high currents, then switching capability is improved, but heat generation increases
Solution Approach 1:
The housing is designed to serve as both structural enclosure and heat dissipation system. By incorporating thermal management functionality into the existing housing structure, the patent provides an effective heat dissipation solution without adding separate cooling components, thereby managing the heat generated by high-power switching operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat extraction efficiency, enabling a compact design with reduced production costs and easier installation, while maintaining effective temperature control for the power switches.
Implementation Method 1
a heat sink element (generally made of Al) in thermal coupling with the power switches to adsorb heat generated during operation
Implementation Method 2
an additional heat extraction arrangement to extract heat from said switching assembly and convey at least a portion of the adsorbed heat along said phase conductor through said first and second line terminals
Data Source
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AI summary
Solid state switching device comprising: - a pair of line terminals including first and second line terminals for electrical connection with a corresponding phase conductor of an electric line; - a switching assembly including one or more solid state power switches, the switching assembly having a first and second power terminals electrically connected with the first and second lines terminals, respectively; - a heat sink element in thermal coupling with the switching assembly to adsorb heat from the switching assembly; - an additional heat extraction arrangement to extract heat from the switching assembly and convey at least a portion of the adsorbed heat along the phase conductor through the first and second line terminals.