Electric Switch Heat Pipe Thermal Conduction
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Solution Overview
Problem
Existing control devices for electrical tools, particularly those with high-power direct-current motors and lithium-ion rechargeable batteries, face insufficient heat dissipation issues, leading to reduced operational reliability.
Innovation Solution
A heat pipe is mechanically and thermally linked to the power semiconductor within the control device, transporting heat from the semiconductor to a cooled area associated with the motor cooling air flow, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat sink is used on the outside of the housing to dissipate heat, then heat dissipation is provided, but the heat dissipation capacity is insufficient for high-power applications
Solution Approach 1:
A heat pipe is introduced as an intermediary thermal conduction means between the power semiconductor (heat source) and the cooled area. The heat pipe efficiently transports heat away from the power semiconductor to the cooled area, where it is dissipated by the motor cooling air flow, thereby resolving the insufficient heat dissipation capacity of conventional heat sinks
Solution Approach 2:
The invention utilizes the motor cooling air flow (fluid) to transport heat from the power semiconductor through the heat pipe to the cooled area. The cooling air acts as a fluid medium that carries away the heat, enabling efficient thermal management without requiring additional active cooling systems
2Loss of energy
If conventional heat dissipation methods are used, then the structure is simple, but the heat dissipation efficiency is insufficient for high-power motors
Solution Approach 1:
The invention merges the heat dissipation function with the existing motor cooling system. The heat pipe connects the power semiconductor to the cooled area where motor cooling air already flows, combining thermal management with the motor's existing cooling infrastructure. This achieves high heat dissipation efficiency without significantly increasing device complexity
Solution Approach 2:
The heat pipe serves multiple functions: it acts as a thermal conduction path, a heat transfer medium, and integrates with the motor cooling system. The same cooling air flow that cools the motor also cools the power semiconductor through the heat pipe, achieving multi-functionality with a single cooling mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves operational reliability by efficiently dissipating heat without requiring additional energy, allowing for higher power ranges, smaller components, and cost savings, while eliminating the need for expensive heat sinks.
Implementation Method 1
The heat pipe has a vaporization region at one end and a condensation region at the other end. The heat pipe is expediently for this purpose closed at one end by a vaporizer plate and at the other end by a condensation plate. The heat pipe also contains a fluid, such that the fluid transports heat, with a phase change, to be precise vaporization and condensation, between the vaporization region and the condensation region.
Implementation Method 2
the fluid transports heat, with a phase change, to be precise vaporization and condensation, between the vaporization region and the condensation region
Implementation Method 3
The cooled area is located outside and/or separately from the housing and, in particular, is associated with the control device. [...] the heat is then dissipated by the motor cooling air flow there
Data Source
AI summary
A control device, in particular an electrical switch for use for an electrical tool such as a rechargeable-battery and/or plug-powered electrical tool having an electric motor. The switch has a housing for holding at least one heat-generating component such as a power transistor, a MOSFET, a triac or the like, which is arranged in particular in an electrical circuit arrangement which, for example, is used for open-loop and/or closed-loop control of the electric motor by appropriate open-loop and/or closed-loop control of the electrical load current flowing through the component to the electric motor. A means for thermal conduction is connected on the one hand to the housing of the electrical switch, and/or to the heat-generating component, in particular to the power semiconductor which is located in the housing, and on the other hand to a cooled area which is associated with the switch.