Network Switch IC Package Optical Module Integration
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Solution Overview
Problem
Network switches face limitations in transmitting high-speed communication signals over long distances due to signal integrity issues and excessive heat production, leading to short transmission ranges and increased costs.
Innovation Solution
The integration of electro-optical transducers into a network switch IC package, with distinct electrical connections for communication and control signals, and advanced heat dissipation modules using heat conduction and convection techniques, allows for efficient signal transmission and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electro-optical transducers are integrated into the IC package with distinct electrical connections for communication and control signals, then signal integrity is enhanced and transmission distance is extended, but device complexity increases
Solution Approach 1:
The patent divides the electrical connections into two distinct sets: first electrical connections for communication signals and second electrical connections for control signals. This segmentation allows independent optimization of each connection type, improving signal integrity while managing complexity through functional separation.
Solution Approach 2:
The patent extends electrical connections in multiple dimensions - first connections extend on a first plane and second connections extend on a second plane, with connections to electro-optical transducers extending in a third dimension. This multi-dimensional approach enables better signal separation and reduces interference, enhancing signal integrity without proportionally increasing planar complexity.
2Reliability
If heat dissipation modules are added to manage heat from IC and electro-optical transducers, then operational reliability improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent integrates heat dissipation functionality directly into the IC package structure, merging thermal management with the existing electronic components. The heat dissipation modules are positioned to simultaneously manage heat from both the IC and electro-optical transducers, creating a unified thermal management system that improves reliability without requiring separate independent cooling systems.
Solution Approach 2:
The patent implements localized heat dissipation modules positioned specifically at heat-generating points - adjacent to the IC and electro-optical transducers. This local approach targets thermal management to where it is most needed, improving operational reliability at critical components while avoiding the complexity of system-wide cooling solutions.
3Productivity
If multiple electrical connections are implemented for communication and control signals, then switch capacity increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments electrical connections into dedicated first connections for communication signals and second connections for control signals. This segmentation allows each connection type to be optimized independently for its specific signal requirements, enabling increased switch capacity while maintaining manageable manufacturing precision requirements through specialized connection designs.
Solution Approach 2:
The patent utilizes multi-planar connection architecture where first electrical connections extend on a first plane and second electrical connections extend on a second plane. This dimensional separation allows higher capacity connections without proportionally increasing planar trace complexity, as connections can be routed in three-dimensional space rather than constrained to a single plane, thereby reducing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances signal integrity and extends transmission distances, reduces the number of hand-over points, and increases switch capacity by effectively managing heat dissipation, thereby improving network efficiency and reducing operational failures.
Implementation Method 1
at least one of the first and second heat dissipation modules is configured to transfer heat using heat conduction
Implementation Method 2
at least one of the first and second heat dissipation modules is configured to transfer heat using a combination of heat conduction and heat convection
Implementation Method 3
at least one of the first and second heat dissipation modules is configured to transfer heat using heat conduction
Implementation Method 4
at least one of the first and second heat dissipation modules is configured to transfer heat using heat convection
Implementation Method 5
one of the first and second heat dissipation modules, which is configured to transfer the heat using heat convection, includes one or more heat pipes configured to run a cooling fluid
Implementation Method 6
one of the first and second heat dissipation modules, which is configured to transfer the heat using heat convection, includes one or more heat pipes configured to run a cooling fluid
Data Source
AI summary
An apparatus includes, an Integrated Circuit (IC), first electrical connections and second electrical connections. The IC is mounted on a substrate and is configured to exchange one or more communication signals with one or more electro-optical transducers, and to exchange one or more control signals with external circuitry. The first electrical connections extend from the IC on a plane parallel to the substrate, and are configured to conduct the communication signals. The second electrical connections extend from the IC on one or more planes not parallel to the substrate, and are configured to conduct the control signals.