Switch-Mode Converter Module Using Magnetic Mold Encapsulation

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Solution Overview

Problem

Switch-mode power supply modules face challenges in reducing cost and size while maintaining performance, with magnetic components like inductors being the largest and most expensive, limiting module size and increasing costs.

Innovation Solution

The manufacturing method involves forming windings and attaching them to a substrate, inserting a magnetic core, and encapsulating the entire module in magnetic mold material, rather than just the winding, to increase inductor size within the module and reduce production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If magnetic components like inductors are made larger to improve performance, then inductance and EMI shielding are enhanced, but module size and manufacturing cost increase

Engineering Contradiction:

Improveinductance performanceVSAvoidmodule size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent merges the inductor winding, magnetic core, and encapsulation into a single integrated structure where the entire module is encapsulated in magnetic mold material. This combining of functions allows the inductor to be larger for better performance while the integrated encapsulation prevents module size from proportionally increasing.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses magnetic mold compound that combines encapsulation and magnetic shielding functions into a single composite material. This composite material provides both structural protection and magnetic field management, allowing larger inductors without proportionally increasing overall module volume.

Inventive Principle:

Principle #40Composite materials

2Reliability

If magnetic components like inductors are made larger to improve performance, then inductance and EMI shielding are enhanced, but manufacturing cost increases

Engineering Contradiction:

Improveinductance performanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple manufacturing functions into a single encapsulation step using magnetic mold compound. This merging of encapsulation, magnetic core integration, and EMI shielding into one process reduces the number of discrete manufacturing steps, lowering overall production cost despite using larger magnetic components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The magnetic mold compound serves as a composite material that provides multiple functions (encapsulation, magnetic path, EMI shielding) simultaneously. This multi-functionality reduces the need for separate components and assembly steps, thereby reducing manufacturing cost despite improved inductance performance.

Inventive Principle:

Principle #40Composite materials

3Reliability

If the entire module is encapsulated in magnetic mold material, then inductance and EMI shielding are improved, but manufacturing complexity increases

Engineering Contradiction:

ImproveEMI shieldingVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges EMI shielding, structural encapsulation, and magnetic flux management into a single magnetic mold compound material. This consolidation improves EMI shielding and inductance while actually simplifying the manufacturing process by reducing the number of separate manufacturing steps required.

Inventive Principle:

Principle #5Merging (Combining)

4Ease of manufacture

If magnetic components are reduced in size to reduce cost, then manufacturing cost decreases, but inductance performance and EMI shielding deteriorate

Engineering Contradiction:

Improvemanufacturing costVSAvoidinductance performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The magnetic mold compound acts as a composite material that provides enhanced magnetic properties and EMI shielding at reduced component sizes. The composite nature of the material allows for better magnetic flux management within smaller volumes, maintaining inductance performance while reducing overall component size and cost.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for a larger inductor size relative to the module, reducing manufacturing costs and improving performance by encapsulating the entire module in magnetic mold material, thereby enhancing inductance and shielding from electromagnetic interference.

Implementation Method 1

A core of magnetic material is inserted into the winding

Methodology Applied

Scientific EffectMagnetic flux concentration: Magnetic Field

Implementation Method 2

The winding, the magnetic core, and the power supply switching component are encapsulated in a magnetic mold compound

Methodology Applied

Scientific EffectElectromagnetic shielding: Magnetic Field

Data Source

PatentUS11348808B2Switch-mode converter module

Publication Date: 2022.05.31 TEXAS INSTRUMENTS INC

AI summary

A method for manufacturing a switch-mode converter includes forming a plurality of windings by coiling one or more conductors. Each of the windings is secured to one of a plurality of module bases arranged in a module array. At least one side of the array is encapsulated in a magnetic mold compound.